IP Library › Assignment 064438/0067

Patent Assignment

Reel/Frame 064438/0067

Merger

Recorded: 2023-07-31 Pages: 4

View PDF Order Certified Copy

Assignor

ADVANCED CHIP ENGINEERING TECHNOLOGY INC.

Executed: 2012-06-20

Assignee

ADL ENGINEERING INC.

5F, NO. 65, GUANGFU N. RD. ZHONGXING VIL.,, HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN

Covered Property (1)

Package Structure and Manufacturing Method Thereof

Patent: 8,058,102 →

Application: 12/615,682 →

Publication: US 2011/0108977

Related Assignments (3)

Other recorded transfers of the patent in this record — the chain of ownership.

Assignment of Assignor's Interest Nov 10, 2009

From: LIN, DIANN-FANG; HU, YU-SHAN

To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.

Reel/Frame 023496/0734 →

Change of Name Jul 31, 2023

From: ADL ENGINEERING INC.

To: ADL ENERGY CORP.

Reel/Frame 064444/0857 →

Assignment of Assignor's Interest Oct 27, 2023

From: ADL ENERGY CORP.

To: SAMSUNG ELECTRONICS CO., LTD.

Reel/Frame 065373/0830 →