Package structure and manufacturing method thereof
View Patent ↗The present invention discloses a semiconductor device package structure with redistribution layer (RDL) and through silicon via (TSV) techniques. The package structure comprises an electronic element which includes a dielectric layer on a backside surface of the electronic element, a plurality of first conductive through vias across through the electronic element and the dielectric layer, and a plurality of conductive pads accompanying the first conductive through vias on an active surface of the electronic element; a filler material disposed adjacent to the electronic element; a first redistribution layer disposed over the dielectric layer and the filler material, and connected to the first conductive through vias; a first protective layer disposed over the active surface of the electronic element, the conductive pads, and the filler material; and a second protective layer disposed over the redistribution layer, the dielectric layer, and the filler material.
1. A manufacturing method for a package structure, comprising:
providing an electronic element which includes a dielectric layer on a backside surface of said electronic element, a plurality of conductive through vias across through said electronic element and said dielectric layer, and a plurality of conductive pads accompanying said conductive through vias on an active surface of said electronic element;
filling filler material adjacent to said electronic element;
forming a first protective layer to cover the active surface of said electronic element and said filler material;
forming first redistribution layer over said dielectric layer and filler material, and connected to said conductive through vias; and
forming a second protective layer to cover said first redistribution layer, said filler material, and said dielectric layer.
2. The manufacturing method according to claim 1 , further comprising:
forming a second redistribution layer over said first protective layer and connected to said conductive pads.
3. The manufacturing method according to claim 2 , further comprising:
forming a plurality of conductive balls on said second protective layer and connected to said first redistribution layer.
4. The manufacturing method according to claim 3 , further comprising:
forming a third protective layer to cover said second redistribution layer, said filler material, and said first protective layer, and
forming a plurality of conductive balls on said third protective layer and connected to said second redistribution layer.
5. The manufacturing method according to claim 2 , further comprising:
forming a plurality of second conductive through vias across through said filler to connect said second redistribution layer, and electrically connect to said electronic element; and
forming a third redistribution layer over the filler to connect said second conductive through vias.
6. The manufacturing method according to claim 5 , further comprising:
forming a third protective layer to cover said second redistribution layer, said filler material, and said first protective layer, and
forming a plurality of solder bumps on said second protective layer and connected to said first and third redistribution layers.
7. The manufacturing method according to claim 5 , wherein the process of forming said second conductive through vias comprises laser drilling.