IP Library Assignment 023498/0862
Patent Assignment
Reel/Frame 023498/0862

Assignment of Assignor's Interest

Recorded: 2009-11-12 Pages: 3
Assignor
Assignee
CABOT MICROELECTRONICS CORPORATION
870 NORTH COMMONS DRIVE, AURORA, ILLINOIS, 60504
Covered Properties (4)
Polishing Slurries for Copper and Associated Materials
Patent: 6,409,781 →
Application: 09/562,298 →
Polishing Slurries for Copper and Associated Materials
Patent: 6,527,819 →
Application: 10/022,308 →
Publication: US 2002/0124474
Polishing Slurries for Copper and Associated Materials
Patent: 6,936,542 →
Application: 10/022,317 →
Publication: US 2002/0081865
Polishing Slurries for Copper and Associated Materials
Patent: 7,427,567 →
Application: 11/145,807 →
Publication: US 2006/0084272
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 1, 2000
From: WOJTCZAK, WILLIAM A.; BAUM, THOMAS H.; NGUYEN, LONG; REGULSKI, CARY
To: ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 010771/0179 →
Assignment of Assignor's Interest Apr 1, 2002
From: WOJTCZAK, WILLIAM A.; BAUM, THOMAS H.; NGUYEN, LONG; REGULSKI, CARY
To: ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 012776/0193 →
Document Previously Recorded on Reel 012776 Frame 0193 Contained an Error in Serial Number 09216673. Document Re-Recorded to Correct Error on Stated Reel Jul 15, 2002
From: WOJTCZAK, WILLIAM A.; BAUM, THOMAS H.; NGUYEN, LONG; REGULSKI, CARY
To: ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 013125/0583 →
Notice of Security Interest in Patents Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
Release of Security Interest Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
Security Agreement Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Release of Security Interest Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →