IP Library › Assignment 023832/0471
Patent Assignment
Reel/Frame 023832/0471

Assignment of Assignor's Interest

Recorded: 2010-01-22 Pages: 2
Assignor
COHEN, URI
Executed: 2010-01-21
Assignee
SEED LAYERS TECHNOLOGY LLC
MONTELBELLO PARK, 75 MONTEBELLO PARK, SUFFERN, NEW YORK, 10901-3746
Covered Properties (12)
Apparatus for Depositing Seed Layers
Patent: 7,682,496 →
Application: 11/391,035 →
Publication: US 2006/0166448
Seed Layers for Electroplated Interconnects
Application: 12/471,557 →
Publication: US 2009/0239372
Seed Layers for Metallic Interconnects
Patent: 9,673,090 →
Application: 12/471,571 →
Publication: US 2009/0233440
Seed Layers for Interconnects and Methods for Fabricating Such Seed Layers
Patent: 6,136,707 →
Application: 09/410,898 →
Multiple Seed Layers for Metallic Interconnects
Patent: 6,518,668 →
Application: 09/730,220 →
Publication: US 2001/0005056
Seed Layers for Interconnects and Methods and Apparatus for Their Fabrication
Patent: 6,610,151 →
Application: 09/563,733 →
Combined Conformal/Non-Conformal Seed Layers for Metallic Interconnects
Patent: 6,903,016 →
Application: 10/640,846 →
Publication: US 2004/0087171
Methods for Making Multiple Seed Layers for Metallic Interconnects
Patent: 6,924,226 →
Application: 10/328,629 →
Publication: US 2003/0129828
Advanced Seed Layery for Metallic Interconnects
Patent: 7,105,434 →
Application: 11/023,833 →
Publication: US 2005/0124153
Seed Layers for Metallic Interconnects
Patent: 7,199,052 →
Application: 11/057,485 →
Publication: US 2005/0148172
Multiple Seed Layers for Interconnects
Patent: 7,282,445 →
Application: 11/654,478 →
Publication: US 2007/0117379
Advanced Seed Layers for Interconnects
Patent: 7,550,386 →
Application: 11/868,435 →
Publication: US 2008/0026569
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 6, 2012
From: SEED LAYER TECHNOLOGY, LLC
To: COHEN, URI, DR.
Reel/Frame 029420/0866 →