Patent Assignment
Reel/Frame 029420/0866
Assignment of Assignor's Interest
Recorded: 2012-12-06
Pages: 3
Assignor
SEED LAYER TECHNOLOGY, LLC
Executed: 2012-12-05
Assignee
COHEN, URI, DR.
4147 DAKE AVENUE, PALO ALTO, CALIFORNIA, 94306
Covered Properties
(15)
Seed Layers for Electroplated Interconnects
Application:
12/471,557 →
Publication:
US 2009/0239372
Seed Layers for Metallic Interconnects
Seed Layers for Metallic Interconnects and Products
Seed Layers for Interconnects and Methods for Fabricating Such Seed Layers
Application:
13/294,418 →
Seed Layers for Interconnects and Methods for Fabricating Such Seed Layers
Patent:
6,136,707 →
Application:
09/410,898 →
Multiple Seed Layers for Metallic Interconnects
Seed Layers for Interconnects and Methods and Apparatus for Their Fabrication
Patent:
6,610,151 →
Application:
09/563,733 →
Combined Conformal/Non-Conformal Seed Layers for Metallic Interconnects
Methods for Making Multiple Seed Layers for Metallic Interconnects
Advanced Seed Layery for Metallic Interconnects
Seed Layers for Metallic Interconnects
Multiple Seed Layers for Interconnects
Advanced Seed Layers for Interconnects
Apparatus for Depositing Seed Layers
Apparatus for Making Interconnect Seed Layers and Products
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 22, 2010
From: COHEN, URI
To: SEED LAYERS TECHNOLOGY LLC
Reel/Frame 023832/0471 →
Assignment of Assignor's Interest
Dec 2, 2011
From: COHEN, URI
To: SEED LAYERS TECHNOLOGY
Reel/Frame 027325/0664 →
Assignment of Assignor's Interest
Jan 24, 2012
From: COHEN, URI, DR.
To: SEED LAYERS TECHNOLOGY, LLC
Reel/Frame 027584/0448 →