IP Library › Assignment 024990/0265
Patent Assignment
Reel/Frame 024990/0265

Security Agreement

Recorded: 2010-09-15 Received: 2010-09-15 Pages: 8
Assignor
Assignee
WILMINGTON TRUST FSB
1100 NORTH MARKET STREET, RODNEY SQUARE NORTH, WILMINGTON, DE, 19890, UNITED STATES
Covered Properties (21)
Mat for Charging an Electronic Device
Application: 29/330,361 →
Method for Manufacturing a Composite Material Including Copper Foil and Support Layer
Application: 11/593,949 →
Copper alloy containing cobalt, nickel and silicon
Application: 11/588,111 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application: 11/246,966 →
Support Layer for Thin Copper Foil
Application: 10/965,347 →
Fretting and Whisker Resistant Coating System and Method
Application: 10/962,917 →
Tarnish Deterring Tin Coating
Application: 10/930,316 →
Peel Strength Enhancement of Copper Laminates
Application: 10/727,920 →
Chromium-Free Antitarnish Adhesion Promoting Treatment Composition
Application: 10/653,582 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application: 10/610,433 →
Bond Enhancement Antitarnish Coatings
Application: 10/017,863 →
Copper Foil with Low Profile Bond Enhancement
Application: 09/948,166 →
Silver Containing Copper Alloy
Application: 09/923,137 →
Water-Based Adhesive
Application: 09/907,224 →
Copper Alloy Having Improved Stress Relaxation Resistance
Application: 09/879,616 →
Tailored Solutionizing of Aluminum Sheets
Application: 09/876,892 →
Method and Apparatus for the Manufacturing of Structural Members
Application: 09/849,943 →
Copper Foil Composite Including a Release Layer
Application: 09/842,454 →
Process for Making Copper-Tin-Zinc Alloys
Application: 09/808,337 →
Copper Alloy
Application: 09/800,989 →
Copper Foil with Low Profile Bond Enhancement
Application: 09/784,547 →