Patent Assignment
Reel/Frame 026810/0785
Assignment of Assignor's Interest
Recorded: 2011-08-25
Pages: 4
Assignors
SIDHU, RAJWANT S.
Executed: 2011-08-23
ZEPEDA, RUBEN
Executed: 2011-08-23
LOPEZ, CARLOS A.
Executed: 2011-08-23
Assignee
DDI GLOBAL CORPORATION
1220 SIMON CIRCLE, ANAHEIM, CALIFORNIA, 92806
Covered Property
(1)
Systems and Methods for Reducing Overhang on Electroplated Surfaces of Printed Circuit Boards
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 31, 2013
From: DDI GLOBAL CORP.
To: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
Reel/Frame 031863/0129 →
Assignment of Assignor's Interest
Jan 10, 2014
From: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
To: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Reel/Frame 031937/0500 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Change of Name
May 12, 2023
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, INC.
Reel/Frame 063635/0226 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →