Patent Assignment
Reel/Frame 027387/0793
Security Agreement
Recorded: 2011-12-15
Pages: 13
Assignor
IRVINE SENSORS CORPORATION
Executed: 2011-12-14
Assignee
PARTNERS FOR GROWTH III, L.P.
150 PACIFIC AVENUE, SAN FRANCISCO, CALIFORNIA, 94111
Covered Properties
(68)
Automatic Miter Machine
Application:
12/045,880 →
Publication:
US 2009/0229503
Second imaging device adaptable for use with first imaging device and method for using same
Application:
12/456,345 →
Micro-combustion power system with dual path counter-flow system
Patent:
8,614,392 →
Application:
12/584,460 →
Portable Lip Reading Sensor System
Patent:
8,271,262 →
Application:
12/586,477 →
Micro Gas Cell Array Device and Method
Patent:
8,264,689 →
Application:
12/653,730 →
Thermal power distribution system
Application:
12/657,090 →
Publication:
US 2011/0168378
Apparatus Comprising Artificial Neuronal Assembly
Micro-Image Acquisition and Transmission System
Launch tube deployable and reconnaissance system
Application:
12/799,297 →
Publication:
US 2011/0168838
Micro-combustion power system with metal foam heat exchanger
Application:
12/800,746 →
Publication:
US 2011/0023927
Repositionable Lens Cover
Gravity Operated, Rotatable Lens Curtain for Thermal Imager
Phase Sensing and Scanning Time of Flight Ladar Using Atmospheric Absorption Bands
Am Chirp Ladar Readout Circuit and Module
Energy Harvesting Buoy
Tamper-resistant electronic circuit and module incorporating electrically conductive nano-structures
Application:
12/806,127 →
Publication:
US 2011/0031982
Frequency Modulated Micro-Gyro Signal Processing Method and Device
Energy-Efficient Micro-Combustion System for Power Generation and Fuel Processing
Multi-layer photon counting electronic module
Application:
12/924,141 →
Publication:
US 2011/0084212
Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias
Application:
12/925,147 →
Publication:
US 2011/0085304
Ultra-low profile multi-chip module
Application:
12/925,620 →
Publication:
US 2011/0096511
Method and device comprising fused ultrasound and magnetic resonance imaging
Application:
12/927,499 →
Publication:
US 2011/0137148
Compact intelligent surveillance system comprising intent recognition
Application:
12/928,083 →
Publication:
US 2011/0134245
Quick release launch connector for micro unmanned aerial vehicle
Application:
12/928,796 →
Publication:
US 2011/0150565
High density array module and connector
Application:
12/928,797 →
Publication:
US 2011/0147568
Large Displacement Micro-Lamellar Grating Interferometer
Application:
13/010,745 →
Publication:
US 2011/0181885
Anti-Tampering Obscurity Using Firmware Power Mirror Compiler
Secure Anti-Tamper Integrated Layer Security Device Comprising Nano-Structures
Application:
13/045,880 →
Publication:
US 2011/0227603
High-Speed Processor Core Comprising Direct Processor-to-Memory Connectivity
Patent:
8,519,739 →
Application:
13/098,655 →
Switched and Smart Switched Tracking Power Supply
Anti-Tampering Detection Using Target Circuit RF Signature
Application:
13/098,738 →
Publication:
US 2011/0267190
Fast, High Resolution 3-D Flash LADAR Imager
Application:
13/099,829 →
Publication:
US 2013/0107243
Sensor Element and System Comprising Wide Field-of-View 3-D Imaging LIDAR
Application:
13/108,172 →
Publication:
US 2011/0285981
Wear-Resistant Conformal Coating for Micro-Channel Structure
Application:
13/155,986 →
Publication:
US 2011/0303404
Wire Bond Through-Via Structure and Method
Method for Control of Solder Collapse in Stacked Microelectronic Structure
Application:
13/209,933 →
Publication:
US 2012/0069528
Method for Depackaging Prepackaged Integrated Circuit Die and a Product from the Method
Alignment and Lead Insertion Device for an Electronic Component
Method for Defining an Electrically Conductive Metal Structure on a Three-Dimensional Element and a Device Made From the Method
Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die
Low Power Image Intensifier Device Comprising Black Silicon Detector Element
Application:
13/272,341 →
Publication:
US 2012/0092390
Self-Calibrating Targeting Sight
Lens cap
Application:
61/217,565 →
Alignment and lead insertion device for an electronic component
Application:
61/404,123 →
USB Memory Device Comprising Locking Feature
Application:
61/439,236 →
Dual Connection USB Device
Application:
61/439,242 →
USB Device Comprising Anti-Tamper Means
Application:
61/439,252 →
Variable Current, High Bandwidth USB Device
Application:
61/439,255 →
USB Device Comprising Means for Data Throttling
Application:
61/439,257 →
USB Safe House Computing and Storage Device
Application:
61/439,259 →
LADAR System Comprising Large Area Focal Plane Array and Risley Prism Beam Steering
Application:
61/442,404 →
Anti-Tamper Wrapper Interconnect Method and Device
Application:
61/443,482 →
Small Footprint Chip Scale Package From a Single Die
Application:
61/444,860 →
On-Board Non-Uniformity Correction Calibration Method for Microbolometer Focal Plane Array
Application:
61/444,970 →
Nano-Resonator inertial sensor assembly (NRISA)
Application:
61/459,441 →
Micro-channel plate assembly comprising micro-lens
Application:
61/460,172 →
Micro-channel plate assembly for use with an electronic imaging device
Application:
61/460,173 →
Unit cell spectrometer
Application:
61/460,846 →
Micro-Connector for Stackable Layers
Application:
61/491,385 →
Gravity Stabilized Sensor Bench for Moving Platforms
Application:
61/491,685 →
Physically Unclonable Sense and Respond Module
Application:
61/492,156 →
Wave Energy Capture System
Application:
61/493,110 →
Materials and Methods for Hepatitis C Virus Amplification and DNA Sequencing
Application:
61/498,870 →
Cap Chip for Integrated Circuit Chip Stack
Application:
61/509,308 →
Captive Float Nut
Application:
61/511,808 →
Ground Tracking Orientation Sensor
Application:
61/515,193 →
Background Limited Focal Plane Array Device Comprising Ultra-Low Noise Readout Integrated Circuit and Thermoelectric Superlattice Focal Plane Array Structure
Application:
61/526,077 →
Batch Suspension Process for the Manufacture of Vinylidene Chloride Terpolymers
Application:
61/539,238 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 23, 2008
From: MARCANGELO, STEVEN; BRUNNERT, JUSTIN; BROTTLUND, VON
To: L & P PROPERTY MANAGEMENT COMPANY
Reel/Frame 020844/0363 →
Assignment of Assignor's Interest
Oct 9, 2009
From: HORNBACK, WILLIAM
To: IRVINE SENSORS CORPORATION
Reel/Frame 023367/0145 →
Assignment of Assignor's Interest
Nov 9, 2009
From: RONNEY, PAUL
To: IRVINE SENSORS CORPORATION
Reel/Frame 023496/0343 →
Assignment of Assignor's Interest
Nov 27, 2009
From: HARWOOD, DOUGLAS
To: IRVINE SENSORS CORPORATION
Reel/Frame 023577/0298 →
Assignment of Assignor's Interest
Nov 27, 2009
From: HSU, YING
To: IRVINE SENSORS CORPORATION
Reel/Frame 023577/0301 →
Assignment of Assignor's Interest
Dec 7, 2009
From: SAPIR, ITZHAK
To: IRVINE SENSORS CORPORATION
Reel/Frame 023625/0888 →
Assignment of Assignor's Interest
Dec 7, 2009
From: SNYDER, G. JEFFREY
To: IRVINE SENSORS CORPORATION
Reel/Frame 023625/0885 →
Assignment of Assignor's Interest
Jan 11, 2010
From: HSU, YING
To: IRVINE SENSORS CORPORATION
Reel/Frame 023767/0087 →
Assignment of Assignor's Interest
Feb 5, 2010
From: CARSON, JOHN
To: IRVINE SENSORS CORPORATION
Reel/Frame 023929/0093 →
Assignment of Assignor's Interest
Feb 12, 2010
From: BOYD, W. ERIC
To: IRVINE SENSORS CORPORATION
Reel/Frame 023952/0185 →
Assignment of Assignor's Interest
Feb 16, 2010
From: HSU, YING
To: IRVINE SENSORS CORPORATION
Reel/Frame 023958/0963 →
Assignment of Assignor's Interest
Feb 16, 2010
From: HSU, YING
To: IRVINE SENSORS CORPORATION
Reel/Frame 023958/0926 →
Assignment of Assignor's Interest
Feb 19, 2010
From: AZZAZY, MEDHAT
To: IRVINE SENSORS CORPORATION
Reel/Frame 023969/0523 →
Security Agreement
Apr 19, 2010
From: IRVINE SENSORS CORPORATION
To: LOONEY, TIMOTHY
Reel/Frame 024253/0953 →
Assignment of Assignor's Interest
May 21, 2010
From: SAPIR, ITZHAK; AZZAZY, MEDHAT; HSU, YING
To: IRVINE SENSORS CORPORATION
Reel/Frame 024461/0923 →
Assignment of Assignor's Interest
Jun 7, 2010
From: CARSON, JOHN
To: IRVINE SENSORS CORPORATION
Reel/Frame 024498/0339 →
Assignment of Assignor's Interest
Jul 19, 2010
From: HORNBACK, WILLIAM; HOLLY, MICHAEL
To: IRVINE SENSORS CORPORATION
Reel/Frame 024704/0386 →
Assignment of Assignor's Interest
Oct 27, 2010
From: LUDWIG, DAVID; AZZAZY, MEDHAT
To: IRVINE SENSORS CORPORATION
Reel/Frame 025203/0457 →
Assignment of Assignor's Interest
Oct 27, 2010
From: LUDWIG, DAVID
To: IRVINE SENSORS CORPORATION
Reel/Frame 025203/0493 →
Assignment of Assignor's Interest
Nov 12, 2010
From: SAPIR, ITZHAK
To: IRVINE SENSORS CORPORATION
Reel/Frame 025303/0251 →
Assignment of Assignor's Interest
Nov 15, 2010
From: BINDRUP, RANDY; MIYAKE, MICHAEL
To: IRVINE SENSORS CORPORATION
Reel/Frame 025306/0177 →
Assignment of Assignor's Interest
Nov 22, 2010
From: SAPIR, ITZHAK; BOYD, W ERIC
To: IRVINE SENSORS CORPORATION
Reel/Frame 025308/0316 →
Assignment of Assignor's Interest
Nov 22, 2010
From: OZGUZ, VOLKAN; YAMAGUCHI, JAMES; BOYD, W ERIC
To: IRVINE SENSORS CORPORATION
Reel/Frame 025308/0333 →
Assignment of Assignor's Interest
Jan 20, 2011
From: CLARK, STEWART
To: IRVINE SENSORS CORPORATION
Reel/Frame 025674/0123 →
Assignment of Assignor's Interest
Jan 20, 2011
From: CUADRA, DEAN ARTHUR
To: IRVINE SENSORS CORPORATION
Reel/Frame 025674/0173 →