Patent Assignment
Reel/Frame 027473/0607
Assignment of Assignor's Interest
Recorded: 2012-01-03
Pages: 3
Assignors
LEE, TZUNG-HAN
Executed: 2011-12-22
HUANG, CHUNG-LIN
Executed: 2011-12-22
CHU, RON FU
Executed: 2011-12-22
LIU, DAH-WEI
Executed: 2011-12-22
Assignee
INOTERA MEMORIES, INC.
667, FUHSING 3RD., HWA-YA TECHNOLOGY PARK KUEISHAN, TAOYUAN, TAIWAN
Covered Property
(1)
Semiconductor Structure Having Lateral Through Silicon Via
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 3 to Patent Security Agreement
Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
Assignment of Assignor's Interest
Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →