Patent Assignment
Reel/Frame 027606/0657
Assignment of Assignor's Interest
Recorded: 2012-01-27
Received: 2012-01-27
Pages: 11
Assignor
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC.
Executed: 2011-11-04
Assignee
SCHILMASS CO. L.L.C.
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DE, 19808, UNITED STATES
Covered Properties
(25)
Broadband High Power Amplifier
Application:
13/081,279 →
High Power Amplifier
Application:
13/016,599 →
Broadband Transmission Line Transformer
Application:
12/507,836 →
Method for the Production of Photo-Patterned Carbon Electronics
Application:
12/497,752 →
Qwip with Electron Launcher for Reducing Dielectric Relaxation Effect in Low Background Conditions
Application:
11/675,653 →
Solid-State Ultra-Wideband Microwave Power Amplifier Employing Modular Non-Uniform Distributed Amplifier Elements
Application:
11/629,025 →
Photonic Coupling Scheme for Photodetectors
Application:
11/601,223 →
Photo-Patterned Carbon Electronics
Application:
11/404,435 →
Broadband Transmission Line Transformer
Application:
11/224,972 →
Method for Connecting Circuit Elements Within an Integrated Circuit for Reducing Single-Event Upsets
Application:
11/116,024 →
Collapsible Wide Band Width Discone Antenna
Application:
11/067,417 →
Use of Radiation-Hardened Chalcogenide Technology for Spaceborne Reconfigurable Digital Processing Systems
Application:
10/918,814 →
Qwip with Tunable Spectral Response
Application:
10/829,574 →
Qwip with Electron Launcher for Reducing Dielectric Relaxation Effect in Low Background Conditions
Application:
10/803,295 →
Qwip with Enhanced Optical Coupling
Application:
10/781,523 →
Reconfigurable Digital Processing System for Space
Application:
10/672,844 →
Collapsible Wide Band Width Discone Antenna
Application:
10/658,186 →
Reconfigurable Digital Processing System for Space
Application:
10/334,317 →
Orthogonally Reconfigurable Integrated Matrix Acoustically Array
Application:
10/308,246 →
Apparatus and Method for Manufacturing a Semiconductor Circuit
Application:
10/177,915 →
Piezocomposite Ultrasound Array and Integrated Circuit Assembly with Improved Thermal Expansion and Acoustical Crosstalk Characteristics
Application:
10/172,536 →
Method and Apparatus for a Voltage Responsive Reset for Eeprom
Application:
10/117,063 →
Acoustical Array with Multilayer Substrate Integrated Circuits
Application:
10/094,851 →
Eyesafe Q-Switched Laser
Application:
09/841,727 →
Sensitized Photoconductive Infrared Detectors
Application:
09/819,384 →