Patent Assignment
Reel/Frame 029119/0516
Assignment of Assignor's Interest
Recorded: 2012-10-12
Pages: 5
Assignor
INDIGO SYSTEMS CORPORATION
Executed: 2012-10-11
Assignee
FLIR SYSTEMS, INC.
27700 SW PARKWAY AVENUE, WILSONVILLE, OREGON, 97070
Covered Properties
(20)
Methods and Circuitry for Correcting Temperature-Induced Errors in Microbolometer Focal Plane Array
Patent:
5,756,999 →
Application:
08/799,663 →
Methods and Circuitry for Correcting Temperature-Induced Errors in Microbolometer Focal Plane Array
Patent:
6,028,309 →
Application:
09/021,714 →
Constant Power Snapshot Microemitter Array with Integral Digital Interface, Isolated Substrate Current Return, and Linearized Signal Response
Patent:
6,316,777 →
Application:
09/285,509 →
Apparatus and Method for Performing Optical Signal Intensity Correction in Electro-Optical Sensor Arrays
Patent:
6,288,387 →
Application:
09/296,044 →
Near Complete Charge Transfer Device
Patent:
6,133,596 →
Application:
09/296,047 →
Large Area Infrared Scene Emitter Riic
Patent:
6,465,798 →
Application:
09/391,789 →
Differential Current Mode Output Circuit for Electro-Optical Sensor Arrays
Patent:
6,344,651 →
Application:
09/427,645 →
Novel Crystal Thinning Method for Improved Yield and Reliability
Patent:
6,465,344 →
Application:
09/802,448 →
Method for Electrically Interconnecting Large Contact Arrays Using Eutectic Alloy Bumping
Patent:
6,550,665 →
Application:
09/876,780 →
Interface Device for Extending Camcorder Use Over the Electromagnetic Spectrum
Patent:
7,050,107 →
Application:
09/905,006 →
Two-Stage Auto-Zero Amplifier Circuit for Electro-Optical Arrays
Patent:
6,803,555 →
Application:
09/949,320 →
Electro-Optical Sensor Arrays with Reduced Sensitivity to Defects
Patent:
6,593,562 →
Application:
09/972,084 →
Microbolometer Focal Plane Array Methods and Circuitry
Infrared Detector Array with Improved Spectral Range and Method for Making the Same
Thermal Imaging Calibration Systems and Methods
Hybrid Gap Measurement Circuit
Microbolometer Detector with High Fill Factor and Transducers Having Enhanced Thermal Isolation
Camera Shutter
Microbolometer Focal Plane Array Systems and Methods
Die Identification Systems and Methods
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
Apr 1, 2016
From: JPMORGAN CHASE BANK, N.A.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; AMIS HOLDINGS, INC.; AMI SEMICONDUCTOR, INC.; AMIS FOREIGN HOLDINGS INC.
Reel/Frame 038171/0254 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Merger and Change of Name
Nov 24, 2021
From: FLIR SYSTEMS, INC.; FIREWORK MERGER SUB II, LLC
To: TELEDYNE FLIR, LLC
Reel/Frame 058832/0915 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →