Patent Assignment
Reel/Frame 038171/0254
Release of Security Interest
Recorded: 2016-04-01
Pages: 7
Assignor
JPMORGAN CHASE BANK, N.A.
Executed: 2010-05-11
Assignees
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
AMIS HOLDINGS, INC.
2300 BUCKSKIN ROAD, POCATELLO, IDAHO, 85008
AMI SEMICONDUCTOR, INC.
2300 BUCKSKIN ROAD, POCATELLO, IDAHO, 83201
AMIS FOREIGN HOLDINGS INC.
2300 BUCKSKIN ROAD, POCATELLO, IDAHO, 83201
AMI ACQUISITION LLC
2300 BUCKSKIN ROAD, POCATELLO, IDAHO, 83201
Covered Properties
(6)
Rom/Ram Overlap Circuit
Patent:
5,912,861 →
Application:
08/965,386 →
Row Fuse Detect Circuit
Patent:
5,923,598 →
Application:
09/063,818 →
Signal Detection Circuit for a Memory Test Mode
Patent:
6,167,543 →
Application:
09/063,819 →
Sram Row Redundancy
Electrostatic Discharge Protection Circuit
Die Identification Systems and Methods
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Bill of Sale
Feb 1, 2010
From: AMI SEMICONDUCTOR, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 023870/0698 →
Assignment of Assignor's Interest
Oct 12, 2012
From: INDIGO SYSTEMS CORPORATION
To: FLIR SYSTEMS, INC.
Reel/Frame 029119/0516 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Merger and Change of Name
Nov 24, 2021
From: FLIR SYSTEMS, INC.; FIREWORK MERGER SUB II, LLC
To: TELEDYNE FLIR, LLC
Reel/Frame 058832/0915 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →