Patent Assignment
Reel/Frame 030699/0279
Assignment of Assignor's Interest
Recorded: 2013-06-27
Pages: 9
Assignors
KANG, MINKYUNG
Executed: 2013-06-26
ROH, YOUNGDAL
Executed: 2013-06-26
JEON, DONG JU
Executed: 2013-06-26
PARK, KYOUNGHEE
Executed: 2013-06-26
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Embedded Pad on Layered Substrate and Method of Manufacture Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039439/0240 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Corrective Assignment to Correct the Name of the Second Assignee Previously Recorded on Reel 052972 Frame 0001. Assignor(S) Hereby Confirms the Deed of Release.
Dec 20, 2023
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD.
Reel/Frame 066123/0885 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →