Patent Assignment
Reel/Frame 030709/0359
Assignment of Assignor's Interest
Recorded: 2013-06-28
Pages: 4
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Trench and Disposing Semiconductor Die Over Substrate to Control Outward Flow of Underfill Material
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0382 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052963/0546 →
This Submission Is to Correct a Typographical Error in the Cover Sheet Previously Recorded on Reel: 038378 Frame: 0382 to Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte." to "Stats Chippac Pte. Ltd."
Sep 6, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064869/0363 →