Patent Assignment
Reel/Frame 031833/0868
Assignment of Assignor's Interest
Recorded: 2013-12-20
Pages: 4
Assignors
CHOI, JOONYOUNG
Executed: 2013-12-19
PARK, SEONG WON
Executed: 2013-12-19
KIM, KYUNGOE
Executed: 2013-12-19
LEE, HUN TEAK
Executed: 2013-12-19
CHO, SUNGWON
Executed: 2013-12-19
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Method of Manufacture of Integrated Circuit Packaging System with Plasma Processing
Patent:
9,093,278 →
Application:
14/137,352 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →