Patent Assignment
Reel/Frame 032268/0632
Merger
Recorded: 2014-02-21
Pages: 6
Assignor
SENSORMATIC ELECTRONICS CORPORATION
Executed: 2009-09-22
Assignee
SENSORMATIC ELECTRONICS, LLC
6600 CONGRESS AVENUE, BOCA RATON, FLORIDA, 33487
Covered Property
(1)
Dark-Field Defect Inspecting Method, Dark-Field Defect Inspecting Apparatus, Aberration Analyzing Method, and Aberration Analyzing Apparatus
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 12, 2011
From: TANIGUCHI, ATSUSHI; UENO, TAKETO; SHIBATA, YUKIHIRO; MAEDA, SHUNJI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 026740/0215 →
Assignment of Assignor's Interest
Feb 21, 2014
From: RASBAND, PAUL B; BAUER, DONALD G; CAMPERO, RICHARD J
To: VUE TECHNOLOGY, INC.
Reel/Frame 032268/0424 →
Merger
Feb 21, 2014
From: VUE TECHNOLOGIES, INC
To: SENSORMATIC ELECTRONICS CORPORATION
Reel/Frame 032268/0542 →
Change of Name and Address
Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →