IP Library Granted Patent US 8,681,328
Granted Patent B2
US 8,681,328 · App. 13/142,328 · Granted Mar 25, 2014

Dark-field defect inspecting method, dark-field defect inspecting apparatus, aberration analyzing method, and aberration analyzing apparatus

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Quick Facts
Patent No.
US 8,681,328
App. No.
13/142,328
Granted
Mar 25, 2014
Kind
B2
Abstract

By including an illumination system and a detection system, an information collecting function of monitoring an environment, such as temperature and atmospheric pressure, and an apparatus state managing function having a feedback function of comparing the monitoring result and a design value, a theoretical calculation value or an ideal value derived from simulation results and calibrating an apparatus so that the monitoring result is brought close to the ideal value, a unit for keeping the apparatus state and apparatus sensitivity constant is provided. A control unit 800 is configured to include a recording unit 801 , a comparing unit 802 , a sensitivity predicting unit 803 , and a feedback control unit 804 . In the comparing unit 802 , the monitoring result transmitted from the recording unit 801 and an ideal value stored in a database 805 are compared with each other. When a difference between the ideal value and the monitoring result exceeds a predetermined threshold, the feedback control unit 804 corrects the illumination system and the detection system.

Claims (30)

1. A dark-field defect inspecting method of obtaining, by a first sensor of a detection system, a signal of scattered light occurring due to illumination light illuminating a surface of an inspection subject, from the surface of the inspection subject and detecting a foreign substance or a defect on the inspection subject based on the signal obtained by the first sensor, the method comprising:

an illumination light monitoring step of measuring either one or both of an intensity distribution and a polarization state distribution of the illumination light;

a detection system monitoring step of detecting an imaging characteristic of a detection lens and a state of operation of a stage on which the inspection subject is placed, by detecting light input to the detection system by a second sensor; and

a feedback control step of comparing detection results in the illumination light monitoring step and the detection system monitoring step and predetermined values and adjusting either one or both of the illumination light and the detection system so that differences between the detection results and the predetermined values are each equal to or smaller than an allowable value.

2. The dark-field defect inspecting method according to claim 1 , wherein the illumination light monitoring step measures either one or both of the intensity distribution and the polarization state distribution of the illumination light by using a specular reflected light.

3. The dark-field defect inspecting method according to claim 1 , wherein the illumination light monitoring step measures either one or both of the intensity distribution and the polarization state distribution of the illumination light on the stage serving as an inspection surface for the inspection subject.

4. The dark-field defect inspecting method according to claim 1 , wherein the illumination light is generated by an illumination system having a laser as a light source, and,

in the illumination light monitoring step, from measurement results of light beams in a process of generating the illumination light, either one or both of the intensity distribution and the polarization state distribution of the illumination light on an inspection surface are estimated.

5. The dark-field defect inspecting method according to claim 1 , wherein the detection system monitoring step detects, by the second sensor, the scattered light obtained by obliquely illuminating a reflective-type optical element with spot light, the optical element having a known characteristic and being placed on the stage serving as an inspection surface for the inspection subject.

6. The dark-field defect inspecting method according to claim 1 , wherein the detection system monitoring step detects, by the second sensor, predetermined light obtained by using a point source of light placed on the stage serving as an inspection surface for the inspection subject and a transmission-type optical element having a known characteristic.

7. The dark-field defect inspecting method according to claim 1 , further comprising an apparatus anomaly checking step of recording changes with time of the detection results in the illumination light monitoring step and the detection system monitoring step and determining an anomaly of an apparatus configuration through a statistical process.

8. The dark-field defect inspecting method according to claim 1 , further comprising a detection result output step of simultaneously displaying the detection results in the illumination light monitoring step and the detection system monitoring step and the ideal values.

9. A dark-field defect inspecting method of obtaining, by a first sensor of a detection system, a signal of scattered light occurring due to illumination light illuminating a surface of an inspection subject, from the surface of the inspection subject and detecting a foreign substance or a defect on the inspection subject based on the signal obtained by the first sensor, the method comprising:

an illumination light monitoring step of measuring either one or both of an intensity distribution and a polarization state distribution of the illumination light;

a detection system monitoring step of detecting an imaging characteristic of a detection lens and a state of operation of a stage on which the inspection subject is placed, by the scattered light input to the detection system by a second sensor;

an environment measuring step of measuring either one or both of temperature and an atmospheric pressure upon execution of the illumination light monitoring step and the detection system monitoring step; and

a feedback control step of comparing detection results in the illumination light monitoring step, the detection system monitoring step, and the environment measuring step and predetermined values and adjusting either one or both of the illumination light and the detection system so that differences between the detection results and the predetermined values are each equal to or smaller than an allowable value.

10. The dark-field defect inspecting method according to claim 9 , further comprising a detection result output step of displaying the detection results in the illumination light monitoring step and the detection system monitoring step and the ideal values.

11. A dark-field defect inspecting apparatus comprising: an illumination system outputting illumination light; a detection system detecting scattered light of the illumination light with which an inspection subject is illuminated; and a control unit, the apparatus obtaining, by a first sensor of the detection system, a signal of the scattered light occurring due to the illumination light illuminating a surface of the inspection subject, from the surface of the inspection subject and detecting a foreign substance or a defect on the inspection subject based on the obtained signal,

the illumination system including illumination light monitoring unit for measuring either one or both of an intensity distribution and a polarization state distribution of the illumination light,

the detection system including detection system monitoring unit for detecting an imaging characteristic of a detection lens and a state of operation of a stage on which the inspection subject is placed, by detecting light input to the detection system by a second sensor, and

the control unit comparing detection results of the illumination light monitoring unit and the detection system monitoring unit and predetermined values and adjusting either one or both of the illumination light and the detection system so that differences between the detection results and the predetermined values are each equal to or smaller than an allowable value.

12. The dark-field defect inspecting apparatus according to claim 11 , wherein the illumination light monitoring unit measures either one or both of the intensity distribution and the polarization state distribution of the illumination light by using specular reflection light.

13. The dark-field defect inspecting apparatus according to claim 11 , wherein the illumination light monitoring unit measures either one or both of the intensity distribution and the polarization state distribution of the illumination light on the stage serving as an inspection surface for the inspection subject.

14. The dark-field defect inspecting apparatus according to claim 11 , wherein a light source of the illumination light is a laser inside the illumination system, and

the illumination light monitoring unit estimates, from measurement results of light beams in a process of generating the illumination light, either one or both of the intensity distribution and the polarization state distribution of the illumination light on an inspection surface.

15. The dark-field defect inspecting apparatus according to claim 11 , wherein the detection system monitoring unit detects, by the second sensor, the scattered light obtained by obliquely illuminating a reflective-type optical element with spot light, the optical element having a known characteristic and being placed on the stage serving as an inspection surface for the inspection subject.

16. The dark-field defect inspecting apparatus according to claim 11 , wherein the detection system monitoring unit detects, by the second sensor, predetermined light obtained by using a point source of light placed on the stage serving as an inspection surface for the inspection subject and a transmission-type optical element having a known characteristic.

17. The dark-field defect inspecting apparatus according to claim 11 , further comprising apparatus anomaly checking unit for recording changes with time of the detection results of the illumination light monitoring unit and the detection system monitoring unit and determining an anomaly of an apparatus configuration through a statistical process.

18. The dark-field defect inspecting apparatus according to claim 11 , further comprising detection result output unit for simultaneously displaying the detection results of the illumination light monitoring unit and the detection system monitoring unit and the ideal values.

Assignments (5)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2014
From: RASBAND, PAUL B; BAUER, DONALD G; CAMPERO, RICHARD J
To: VUE TECHNOLOGY, INC.
Reel/Frame 032268/0424 →
MERGER Recorded Feb 21, 2014
From: VUE TECHNOLOGIES, INC
To: SENSORMATIC ELECTRONICS CORPORATION
Reel/Frame 032268/0542 →
MERGER Recorded Feb 21, 2014
From: SENSORMATIC ELECTRONICS CORPORATION
To: SENSORMATIC ELECTRONICS, LLC
Reel/Frame 032268/0632 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 12, 2011
From: TANIGUCHI, ATSUSHI; UENO, TAKETO; SHIBATA, YUKIHIRO; MAEDA, SHUNJI; MATSUI, TETSUYA
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 026740/0215 →