Patent Assignment
Reel/Frame 034291/0051
Assignment of Assignor's Interest
Recorded: 2014-12-01
Pages: 4
Assignors
JUNG, JINHEE
Executed: 2014-11-25
JEON, DONG JU
Executed: 2014-11-26
PARK, KYOUNGHEE
Executed: 2014-11-25
ROH, YOUNGDAL
Executed: 2014-11-27
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Embedded Component and Method of Manufacture Thereof
Integrated Circuit Packaging System with Embedded Component Having Buried Pattern and Method of Manufacture Thereof
Application:
61/916,405 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Change of Name
Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039428/0928 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →