Patent Assignment
Reel/Frame 035329/0668
Change of Name
Recorded: 2015-04-03
Pages: 27
Assignor
RENESAS KANSAI SEMICONDUCTOR CO., LTD.
Executed: 2014-04-01
Assignee
RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
751, HORIGUCHI, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Properties
(2)
Semiconductor Testing Apparatus for Testing Semiconductor Device Including Built in Self Test Circuit
Patent:
6,311,300 →
Application:
09/196,438 →
Semiconductor Testing Apparatus for Testing Semiconductor Device Including Built in Self Test Circuit
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 20, 1998
From: OMURA, RYUJI; SUGIURA, KAZUSHI; SHIBAYAMA, MARI
To: MITSUBISHI DENKI KABUSHIKI KAISHA; RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
Reel/Frame 009610/0434 →
Assignment of Assignor's Interest
Mar 18, 2011
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025980/0219 →
Merger
Apr 3, 2015
From: RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
To: RENESAS NAKA SEMICONDUCTOR CORP.
Reel/Frame 035329/0587 →
Merger
Apr 3, 2015
From: RENESAS NAKA SEMICONDUCTOR, INC.
To: RENESAS KANSAI SEMICONDUCTOR CO., LTD.
Reel/Frame 035329/0612 →
Assignment of Assignor's Interest
Apr 3, 2015
From: RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035329/0641 →