IP Library Assignment 035507/0377
Patent Assignment
Reel/Frame 035507/0377

Merger

Recorded: 2015-04-28 Pages: 9
Assignor
Assignee
RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
1-1, YAHATA, 1-CHOME, MINAMI-KU,, KUMAMOTO-SHI, KUMAMOTO, JAPAN
Covered Properties (5)
Process for Manufacturing Semiconductor Integrated Circuit Device
Patent: 6,066,508 →
Application: 09/089,398 →
Process for manufacturing semiconductor integrated circuit device including treatment of gas used in the process
Patent: 6,319,860 →
Application: 09/551,551 →
Process for Manufacturing Semiconductor Integrated Circuit Device Including Treatment of Gas Used in the Process
Patent: 6,521,550 →
Application: 09/982,173 →
Publication: US 2002/0019149
Process for Manufacturing Semiconductor Integrated Circuit Device Including Treatment of Gas Used in the Process
Patent: 6,602,808 →
Application: 10/013,729 →
Publication: US 2002/0042211
Process for Manufacturing Semiconductor Integrated Circuit Device Including Treatment of Gas Used in the Process
Patent: 6,723,665 →
Application: 10/404,546 →
Publication: US 2003/0203646
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Apr 28, 2015
From: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 035508/0846 →
Merger Apr 28, 2015
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 035507/0362 →
Merger Apr 28, 2015
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO. LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO. LTD.
Reel/Frame 035507/0389 →
Assignment of Assignor's Interest Apr 28, 2015
From: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035507/0421 →
Merger Apr 28, 2015
From: HITACHI TOKYO ELECTRONICS CO. LTD.
To: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES INC.
Reel/Frame 035508/0803 →
Patent Security Agreement Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement. Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment. Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →