Patent Assignment
Reel/Frame 035789/0969
Assignment of Assignor's Interest
Recorded: 2015-06-04
Pages: 15
Assignors
JOHNSON, CHRIS
Executed: 2013-01-23
JOHNSON, DAVID
Executed: 2013-01-08
MARTINEZ, LINNELL
Executed: 2013-01-18
PAYS-VOLARD, DAVID
Executed: 2013-01-30
GAULDIN, RICH
Executed: 2013-01-18
WESTERMAN, RUSSELL
Executed: 2013-01-14
GRIVNA, GORDON M.
Executed: 2014-04-03
ON SEMICONDUCTOR CORPORATION
Executed: 2014-04-03
SEMICONDUCTOR COMPONENTS INDUSTRIES LLC
Executed: 2014-04-03
ON SEMICONDUCTOR TRADING, SARL
Executed: 2014-04-07
Assignee
PLASMA-THERM LLC
10050 16TH STREET NORTH, ST. PETERSBURG, FLORIDA, 33716
Covered Properties
(3)
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Application:
14/721,462 →
Publication:
US 2015/0255297
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Nov 29, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0357 →
Security Interest
Nov 29, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048174/0001 →
Security Interest
Nov 29, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 048173/0954 →
Security Interest
Nov 30, 2018
From: PLASMA-THERM IC-DISC, INC.; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047687/0418 →
Security Interest
Nov 30, 2018
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0061 →
Security Interest
Nov 30, 2018
From: HINE AUTOMATION, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0644 →
Security Interest
Nov 30, 2018
From: DRYTEK, LLC; LOGIX TECHNOLOGY HOLDINGS, LLC; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047688/0813 →
Security Interest
Nov 30, 2018
From: PLASMA-THERM IC-DISC, INC.; PLASMA-THERM, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 047689/0098 →
Security Interest
May 15, 2020
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM, NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 052679/0001 →
Security Interest
May 15, 2020
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 052679/0788 →
Security Interest
Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058899/0658 →
Security Interest
Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058945/0169 →
Security Interest
Jun 28, 2022
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC
To: VALLEY NATIONAL BANK
Reel/Frame 060447/0766 →
Release of Security Interest
Aug 3, 2022
From: HSBC BANK USA, N.A.
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; PLASMA-THERM IC-DISC, INC.; PLASMA-THERM NES, LLC
Reel/Frame 061070/0642 →