IP Library › Assignment 035792/0037
Patent Assignment
Reel/Frame 035792/0037

Assignment of Assignor's Interest

Recorded: 2015-06-05 Pages: 3
Assignors
SHIH, SHING-YIH
Executed: 2015-06-04
CHIANG, HSU
Executed: 2015-06-04
SHIH, NENG-TAI
Executed: 2015-06-04
Assignee
INOTERA MEMORIES, INC.
NO.667, FUHSING 3RD RD., HWA-YA TECHNOLOGY PARK, GUISHAN DIST., TAOYUAN CITY, 333, TAIWAN
Covered Property (1)
Methods of Fabricating a Semiconductor Package Structure Including at Least One Redistribution Layer
Patent: 9,916,999 →
Application: 14/731,380 →
Publication: US 2016/0358847
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 3 to Patent Security Agreement Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
Assignment of Assignor's Interest Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →