Patent Assignment
Reel/Frame 036645/0734
Assignment of Assignor's Interest
Recorded: 2015-09-22
Received: 2015-09-22
Pages: 152
Assignor
SPANSION, LLC
Executed: 2015-06-01
Assignee
CYPRESS SEMICONDUCTOR CORPORATION
198 CHAMPION COURT, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties
(10)
Fractured Erase System and Method
Application:
14/630,238 →
Semiconductor Device and Method for Manufacturing Thereof
Application:
14/628,939 →
Semiconductor Memory Device Having Lowered Bit Line Resistance
Application:
14/540,803 →
Line-Edge Roughness Improvement for Small Pitches
Application:
14/517,470 →
Electrically Programmable and Eraseable Memory Device
Application:
14/153,900 →
Memory Device Interconnects and Method of Manufacture
Application:
14/102,446 →
Dual Storage Node Memory
Application:
14/033,170 →
Semiconductor Device with Stop Layers and Fabrication Method Using Ceria Slurry
Application:
13/523,568 →
Semiconductor Device and Fabrication Method Therefor
Application:
13/323,538 →
Flip-Chip Package Covered with Tape
Application:
12/962,479 →