Patent Assignment
Reel/Frame 037425/0375
Assignment of Assignor's Interest
Recorded: 2016-01-06
Pages: 3
Assignor
LO, YI-JEN
Executed: 2015-12-29
Assignee
INOTERA MEMORIES, INC.
667, FUHSING 3RD RD., HWA-YA TECHNOLOGY PARK, GUISHAN DIST., TAOYUAN CITY, TAIWAN
Covered Property
(1)
Fan-Out Wafer Level Packaging and Manufacturing Method Thereof
Patent:
9,576,933 →
Application:
14/989,782 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 3 to Patent Security Agreement
Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
Assignment of Assignor's Interest
Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →