Patent Assignment
Reel/Frame 055004/0232
Assignment of Assignor's Interest
Recorded: 2021-01-22
Pages: 4
Assignors
CUI, XIANLU
Executed: 2020-08-05
YAN, JUNRONG
Executed: 2020-08-05
CHIN, CHEECKEONG
Executed: 2020-08-05
QIAN, ZHONGHUA
Executed: 2020-08-05
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 2050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Sloped Interconnector for Stacked Die Package
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Collateral Agreement- A&R
Nov 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 065656/0649 →
Patent Collateral Agreement - Ddtl
Nov 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 065657/0158 →
Assignment of Assignor's Interest
May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
Change of Name
Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
Patent Collateral Agreement
Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →