IP Library › Assignment 074344/0149
Patent Assignment
Reel/Frame 074344/0149

Nunc Pro Tunc Assignment

Recorded: 2026-04-12 Pages: 4
Assignor
HONEYWELL INTERNATIONAL INC.
Executed: 2026-03-24
Assignee
SOLSTICE ADVANCED MATERIALS US, INC.
115 TABOR ROAD, MORRIS PLAINS, NEW JERSEY, 07950
Covered Properties (20)
Process for the Purification of Hydrofluoroolefins
Patent: 8,609,909 →
Application: 12/696,613 →
Publication: US 2010/0193347
Azeotrope-Like Composition of 2,3-Dichloro-3,3-Difluoropropene (Hcfo-1232XF) and Hydrogen Fluoride (Hf)
Patent: 8,114,308 →
Application: 12/749,640 →
Publication: US 2011/0240902
Process for the Manufacture of 1,1,1,3,3-Pentachloropropane
Patent: 9,738,577 →
Application: 11/869,274 →
Publication: US 2008/0091053
Azeotrope-Like Compositions of Pentafluoropropene and 1,1,1,2,2-Pentafluoropropane
Patent: 7,794,618 →
Application: 11/955,587 →
Publication: US 2009/0151365
Polysiloxane Formulations and Coatings for Optoelectronic Applications
Application: 15/522,419 →
Publication: US 2018/0022957
Lead-Free Solder Compositions
Application: 15/119,453 →
Publication: US 2017/0008131
Gap Filling Dielectric Materials
Application: 15/691,096 →
Publication: US 2018/0208796
Gel-Type Thermal Interface Material
Application: 15/642,082 →
Publication: US 2018/0030327
Processable Inorganic and Organic Polymer Formulations, Methods of Production and Uses Thereof
Patent: 8,859,673 →
Application: 12/866,568 →
Publication: US 2011/0054119
Thermal Interface Material and Method of Making and Using the Same
Patent: 9,353,304 →
Application: 13/254,683 →
Publication: US 2011/0308782
Method for Assessing an Alpha Particle Emission Potential of a Metallic Material
Patent: 8,993,978 →
Application: 13/800,115 →
Publication: US 2013/0292579
High Performance Thermal Interface Materials with Low Thermal Impedance
Application: 15/531,253 →
Publication: US 2017/0321100
Thermal Interface Materials Including a Coloring Agent
Application: 15/554,806 →
Publication: US 2018/0358283
Thermal Interface Structure for Optical Transceiver Modules
Application: 16/134,139 →
Publication: US 2019/0190605
Silicone-Free Thermal Gel
Application: 16/105,456 →
Publication: US 2019/0078007
Lead-Free Solder Compositions
Application: 16/035,222 →
Publication: US 2018/0339369
Thermal Interface Material Including Crosslinker and Multiple Fillers
Application: 16/081,649 →
Publication: US 2019/0085225
Releasable Thermal Gel
Application: 16/160,478 →
Publication: US 2019/0119544
Thermal Interface Material with Ion Scavenger
Application: 16/163,255 →
Publication: US 2019/0048245
Gel-Type Thermal Interface Material
Application: 16/267,056 →
Publication: US 2019/0249007
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2007
From: TUNG, HSUEH SUNG; SHANKLAND, IAN
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 019964/0537 →
Assignment of Assignor's Interest Oct 16, 2007
From: TUNG, HSUEH SUNG; SHANKLAND, IAN
To: HONEYWELL INTERNATIONAL INC
Reel/Frame 019968/0668 →
Assignment of Assignor's Interest Dec 13, 2007
From: PHAM, HANG T.; HULSE, RYAN J.; SINGH, RAJIV R.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 020253/0560 →
Assignment of Assignor's Interest Mar 9, 2010
From: HULSE, RYAN; SHANKLAND, IAN; VAN DER PUY, MICHAEL
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 024052/0042 →
Assignment of Assignor's Interest Apr 13, 2010
From: MERKEL, DANIEL C.; PHAM, HANG T.; HULSE, RYAN; SINGH, RAJIV R.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 024224/0135 →
Assignment of Assignor's Interest Nov 10, 2010
From: RUTTER, EDWARD, JR.; KRISHNAMOORTHY, AHILA; KENNEDY, JOSEPH
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 025343/0177 →
Assignment of Assignor's Interest Sep 9, 2011
From: MERRILL, NATALIE; DELANO, ANDREW; STEELE, DAVID
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 026880/0694 →
Assignment of Assignor's Interest Mar 13, 2013
From: CLARK, BRETT M.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 029988/0120 →
Assignment of Assignor's Interest Nov 5, 2013
From: HULSE, RYAN; SINGH, RAJIV RATNA; SHANKLAND, IAN; VAN DER PUY, MICHAEL
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 031544/0297 →
Assignment of Assignor's Interest Aug 17, 2016
From: LI, JIANXING; PINTER, MICHAEL R.; JOHNSON, VIKKI L.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 039467/0252 →
Assignment of Assignor's Interest Apr 28, 2017
From: VARAPRASAD, DESARAJU; MUKHOPADHYAY, SUDIP; XIE, SONGYUAN; GEBREHRHAN, AMANUEL H.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 042172/0238 →
Assignment of Assignor's Interest Jun 22, 2017
From: ZHANG, LIQIANG; SHEN, LING; WANG, HUI; LIU, YA QUN
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 042789/0475 →
Assignment of Assignor's Interest Jul 14, 2017
From: ZHANG, LIQIANG; DUAN, HUIFENG; ZHANG, KAI; LIU, YA QUN
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 043011/0455 →
Assignment of Assignor's Interest Aug 30, 2017
From: PANDEY, YAMINI; XU, HELEN XIAO; KENNEDY, JOSEPH T.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 043451/0062 →
Assignment of Assignor's Interest Aug 31, 2017
From: ZHANG, LIQIANG; MAO, YAQIN; DUAN, HUIFENG; KANG, HAIGANG
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 043463/0842 →
Assignment of Assignor's Interest Sep 7, 2018
From: ZHANG, LIQIANG; DUAN, HUIFENG; PAN, RONGWEI; ZHANG, QI
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 046816/0818 →
Assignment of Assignor's Interest Sep 17, 2018
From: ZHANG, LIQIANG; WANG, WEI JUN; LIU, YA QUN; HUANG, HONG MIN
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 046888/0356 →
Assignment of Assignor's Interest Dec 19, 2018
From: ZHANG, KAI; SHEN, LING; ZHANG, LIQIANG; LIU, YA QUN
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 047819/0268 →
Assignment of Assignor's Interest May 6, 2019
From: LI, JIANXING; PINTER, MICHAEL R.; JOHNSON, VIKKI L.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 049090/0690 →
Security Interest Jan 12, 2026
From: SOLSTICE ADVANCED MATERIALS US, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 074569/0260 →