Stacked integrated circuit package system with connection protection

1. A stacked integrated circuit package process comprising:

connecting an interconnect between an interconnect stack on a first integrated circuit device and a substrate, the first integrated circuit device on the substrate;

applying a protective dot around the interconnect stack on the first integrated circuit device;

mounting a second integrated circuit device, having an adhesive, out of contact with the interconnect stack and on the protective dot, with the adhesive on the first integrated circuit device;

connecting the second integrated circuit device and the substrate; and

encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.

2. The process as claimed in claim 1 wherein applying the protective dot on the first integrated circuit device includes applying the protective dot on the interconnect on the first integrated circuit device.

3. The process as claimed in claim 1 wherein applying the protective dot on the first integrated circuit device includes applying the protective dot on the interconnect on the first integrated circuit device and on a side of the first integrated circuit device next to the interconnect.

4. The process as claimed in claim 1 wherein applying the protective dot on the first integrated circuit device includes applying a plurality of protective dots on the first integrated circuit device.

5. The process as claimed in claim 1 wherein applying the protective dot on the first integrated circuit device includes applying a plurality of protective dots on the first integrated circuit device and the interconnect.

6. A stacked integrated circuit package process comprising:

connecting an interconnect between a ball stack on a first integrated circuit device having a peripheral bond pad and a substrate, the first integrated circuit device on the substrate;

applying a protective dot to cover the interconnect and the ball stack on the peripheral bond pad;

mounting a second integrated circuit device, having an adhesive, out of contact with the ball stack on the protective dot, with the adhesive on the first integrated circuit device;

connecting the second integrated circuit device and the substrate; and encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.

7. The process as claimed in claim 6 wherein:

connecting the interconnect comprises:

forming the interconnect having a wire neck; and

applying the protective dot to cover the interconnect on the peripheral bond pad further comprises:

protecting the wire neck with the protective dot.

8. The process as claimed in claim 6 wherein connecting the interconnect between the first integrated circuit device having the peripheral bond pad and the substrate includes connecting the interconnect on the first integrated circuit device.

9. The process as claimed in claim 6 further comprising forming an additional protective dot as a spacer between the first integrated circuit device and the second integrated circuit device.

10. The process as claimed in claim 6 wherein applying the protective dot includes applying the protective dot comprised of an epoxy or a B-Stage material.

11. A stacked integrated circuit package system comprising:

an interconnect between an interconnect stack on a first integrated circuit device and a substrate, the first integrated circuit device on the substrate;

a protective dot around the interconnect stack on the first integrated circuit device;

a second integrated circuit device, having an adhesive, mounted out of contact with the interconnect stack and on the protective dot, with the adhesive on the first integrated circuit device and the second integrated circuit device connected to the substrate; and

an encapsulation to cover the first integrated circuit device, the second integrated circuit device, and the interconnect.

12. The system as claimed in claim 11 wherein the protective dot on the first integrated circuit device includes the protective dot on the interconnect on the first integrated circuit device.

13. The system as claimed in claim 11 wherein the protective dot on the first integrated circuit device includes the protective dot on the interconnect on the first integrated circuit device and on a side of the first integrated circuit device next to the interconnect.

14. The system as claimed in claim 11 wherein the protective dot on the first integrated circuit device includes a plurality of protective dots on the first integrated circuit device.

15. The system as claimed in claim 11 wherein the protective dot on the first integrated circuit device includes a plurality of protective dots on the first integrated circuit device and the interconnect.

16. The system as claimed in claim 11 wherein:

the interconnect is between the first integrated circuit device having a peripheral bond pad and the substrate, the first integrated circuit device on the substrate;

the protective dot on the first integrated circuit device is on the peripheral bond pad;

the second integrated circuit device, having the adhesive, is on the protective dot, with the adhesive on the first integrated circuit device and the protective dot covered, and the second integrated circuit device connected to the substrate;

the second integrated circuit device is connected to the substrate with a wire; and

the encapsulation to cover the first integrated circuit device, the second integrated circuit device, the interconnect, and the wire.

17. The system as claimed in claim 16 wherein:

the interconnect comprises:

the interconnect having a wire neck; and

the protective dot to cover the interconnect on the first integrated circuit device having the peripheral bond pad further comprises:

the wire neck on the peripheral bond pad protected with the protective dot.

18. The system as claimed in claim 16 wherein the interconnect between the first integrated circuit device having the peripheral bond pad and the substrate includes the interconnect on the first integrated circuit device.

19. The system as claimed in claim 16 further comprising an additional protective dot as a spacer between the first integrated circuit device and the second integrated circuit device.

20. The system as claimed in claim 16 wherein the protective dot comprises an epoxy or a B-Stage material.