IP Library Granted Patent US 6,988,231
Granted Patent B2
US 6,988,231 · App. 09/809,897 · Granted Jan 17, 2006

On-chip method and apparatus for testing semiconductor circuits

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Quick Facts
Patent No.
US 6,988,231
App. No.
09/809,897
Granted
Jan 17, 2006
Kind
B2
Abstract

A semiconductor circuit is disclosed that contains test hardware or test software (or both) that allows test functions to be executed directly from the memory of the semiconductor circuit. A remote testing station can issue a command indicating a specific test function that should be implemented. The disclosed semiconductor circuit independently performs the indicated test and provides the results to the test station. For an exemplary memory test, the test hardware and test software are employed to initially clear the memory and thereafter selectively apply a pattern to memory and read the applied pattern from each address to confirm that the correct pattern has been stored. The testing technique of the present invention reduces the number of pins that must be contacted by the tester, such as the address pins. In addition, the reduced number of contact points allows a number of semiconductor circuits to be setup and tested in parallel using the same automated test equipment (ATE).

Claims (35)

1. A method of testing a semiconductor circuit having a processor, said method comprising the steps of:

providing self-test software on said semiconductor circuit;

initiating the execution of said self-test software by said processor, and wherein said processor executes at least one additional instruction not included in said self-test software; and

monitoring said semiconductor circuit for a result of said self-test software.

2. The method of claim 1 , further comprising the step of applying voltage signals to said semiconductor circuit.

3. The method of claim 2 , wherein said voltage signals include a reset signal.

4. The method of claim 2 , wherein said voltage signals include an enablement signal.

5. The method of claim 1 , further comprising the step of applying clock signals to said semiconductor circuit.

6. The method of claim 1 , wherein said initiating step is performed by a remote tester.

7. The method of claim 1 , wherein said semiconductor circuit includes a memory, and said test software determines if a predefined pattern is properly applied to said memory.

8. The method of claim 1 , wherein said semiconductor circuit includes a logic device, and said test software determines if a logic operation performed on a pattern is valid.

9. A method of testing a semiconductor circuit having a processor, said method comprising the steps of:

providing test software and test hardware on said semiconductor circuit;

initiating the execution of said test software by said processor, said test software employing said test hardware to test said semiconductor circuit, and wherein said processor executes at least one additional instruction not included in said self-test software; and

monitoring said semiconductor circuit for a result of said test.

10. The method of claim 9 , further comprising the step of applying signals to said semiconductor circuit.

11. The method of claim 10 , wherein said semiconductor circuit includes a memory, and said test software determines if a predefined pattern is properly applied to said memory.

12. The method of claim 10 , wherein said semiconductor circuit includes a logic device, and said test software determines if a logic operation performed on a pattern is valid.

13. A method of testing a semiconductor circuit having a processor, said method comprising the steps of:

receiving a command to initiate self-test software previously stored on said semiconductor circuit;

executing said self-test software to control the testing of said semiconductor circuit by said processor, and wherein said processor executes at least one additional instruction not included in said self-test software; and

providing an indication of whether said semiconductor circuit passes said testing.

14. The method of claim 13 , further comprising the step of receiving signals from a remote source.

15. The method of claim 13 , wherein said semiconductor circuit includes a memory, and said self-test software determines if a predefined pattern is properly applied to said memory.

16. The method of claim 13 , wherein said semiconductor circuit includes a logic device, and said self-test software determines if a logic operation performed on a pattern is valid.

17. A semiconductor circuit having a self-test feature, comprising:

a memory that stores computer-readable code including self-test software; and

a processor operatively coupled to said memory, said processor configured to implement said computer-readable code including said self-test software, said computer-readable code configured to:

initiate the execution of said self-test software by said processor, and wherein said processor executes at least one additional instruction not included in said self-test software; and

monitor said semiconductor circuit for a result of said self-test software.

18. A semiconductor circuit having a self-test feature, comprising:

a memory that stores computer-readable code including self-test software; test hardware; and

a processor operatively coupled to said memory, said processor configured to implement said computer-readable code including said self-test software, said computer-readable code configured to:

initiate the execution of said self-test software, said self-test software employing said test hardware to test said semiconductor circuit by said processor, and wherein said processor executes at least one additional instruction not included in said self-test software; and

monitor said semiconductor circuit for a result of said test.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →