IP Library Granted Patent US 6,868,015
Granted Patent B2
US 6,868,015 · App. 09/916,619 · Granted Mar 15, 2005

Semiconductor memory array of floating gate memory cells with control gate spacer portions

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Quick Facts
Patent No.
US 6,868,015
App. No.
09/916,619
Granted
Mar 15, 2005
Kind
B2
Abstract

A self aligned method of forming a semiconductor memory array of floating gate memory cells in a semiconductor substrate has a plurality of spaced apart isolation regions and active regions on the substrate substantially parallel to one another in the column direction. Floating gates are formed in each of the active regions by forming a conductive layer of material. Trenches are formed in the row direction across the active regions, and are filled with a conductive material to form blocks of conductive material that are the control gates. Sidewall spacers of conductive material are formed along the floating gate blocks to give the floating gates protruding portions that extend over the floating gate.

Claims (36)

1. An electrically programmable and erasable memory device comprising:

a substrate of semiconductor material of a first conductivity type,

first and second spaced-apart terminals in the substrate of a second conductivity tupe, with a channel region therebetween;

a first insulation layer disposed over said substrate;

an electrically conductive floating gate disposed over said first insulation layer and extending over a portion of said channel region and over a portion of the second terminal;

a second insulation layer disposed over and adjacent the floating gate and having a thickness permitting Fowler-Nordheim tunneling of charges therethrough; and

an electrically conductive control gate having a first portion and a second portion, the first portion being substantially rectangularly shaped and positioned immediately adjacent to the second insulation layer, the second portion being substantially a spacer connected to the first portion and disposed over the floating gate and insulated therefrom.

2. The device of claim 1 , wherein the control gate forms a notch at the connection between the first portion and the second portion.

3. An array of electrically programmable and erasable memory devices comprising:

a substrate of semiconductor material of a first conductivity type;

spaced apart isolation regions formed on the substrate which are substantially parallel to one another and extend in a first direction, with an active region between each pair of adjacent isolation regions;

each of the active regions including a column of memory cells extending in the first direction, each of the memory cells including:

first and second spaced-apart terminals formed in the substrate having a second conductivity type, with a channel region formed in the substrate therebetween,

a first insulation layer disposed over said substrate including over said channel region,

an electrically conductive floating gate disposed over said first insulation layer and extending over portion of said channel region and over a portion of the second terminal, and

a second insulation layer disposed over and adjacent the floating gate and having a thickness permitting Fowler-Nordheim tunneling of charges therethrough; and

a plurality of electrically conductive control gates each extending across the active regions and isolation regions in a second direction substantially perpendicular to the first direction and having a first portion that is substantially rectangular in shape and a second portion that is connected to the first portion and is substantially a spacer, wherein each of the control gates intercepts one of the memory cells in each of the active regions such that the first portion is positioned immediately adjacent to the second insulation layer and therein and the second portion is disposed over the floating gate and insulated therefrom.

4. The device of claim 3 , wherein the control gate forms a notch at the connection between the first portion and the second portion.

5. An electrically programmable and erasable memory device comprising:

a substrate of semiconductor material of a first conductivity type;

first and second spaced-apart terminals in the substrate of a second conductivity type, with a channel region therebetween;

a first insulation layer disposed over said substrate;

an electrically conductive floating gate disposed over said first insulation layer and extending over a portion of said channel region and over a portion of the second terminal;

a second insulation layer disposed over and adjacent the floating gate and having a thickness permitting Fowler-Nordheim tunneling of charges therethrough; and

an electrically conductive control gate having a first portion and a second portion, the first portion having a substantially planar sidewall portion and is positioned immediately adjacent to the second insulation layer, the second portion being substantially a spacer connected to the substantially planar sidewall portion and disposed over the floating gate and insulated therefrom.

6. The device of claim 5 , wherein the control gate forms a notch at the connection between the first portion and the second portion.

7. An array of electrically programmable and erasable memory devices comprising:

a substrate of semiconductor material of a first conductivity type;

spaced apart isolation regions formed on the substrate which are substantially parallel to one another and extend in a first direction, with an active region between each pair of adjacent isolation regions;

each of the active regions including a column of memory cells extending in the first direction, each of the memory cells including:

first and second spaced-apart terminals formed in the substrate having a second conductivity type, with a channel region formed in the substrate therebetween,

a first insulation layer disposed over said substrate including over said channel region,

an electrically conductive floating gate disposed over said first insulation layer and extending over a portion of said channel region and over a portion of the second terminal, and

a second insulation layer disposed over and adjacent the floating gate and having a thickness permitting Fowler-Nordheim tunneling charges therethrough; and

a plurality of electrically conductive control gates each extending across the active regions and isolation regions in a second direction substantially perpendicular to the first direction and having a first portion that has a substantially planar sidewall portion and a second portion that is connected to the substantially planar sidewall portion and is substantially a spacer, wherein each of the control gates intercepts one of the memory cells in each of the active regions such that the first portion is positioned immediately adjacent to the second insulation layer therein and the second portion is disposed over the floating gate and insulated therefrom.

8. The device of claim 7 , wherein the control gate forms a notch at the connection between the first portion and the second portion.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →