IP Library › Granted Patent US 6,407,448
Granted Patent Utility
US 6,407,448 · Confirmation No. 1231

STACKABLE BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Inventor: Dong Seok Chun
Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-08-06 TRNA Transmittal of New Application 2 View
2001-08-06 SPEC Specification 11 View
2001-08-06 CLM Claims 6 View
2001-08-06 ABST Abstract 1 View
2001-08-06 DRW Drawings-only black and white line drawings 5 View
2001-08-06 OATH Oath or Declaration filed 2 View
2001-08-06 TRNA Transmittal of New Application 2 View
2001-08-06 SPEC Specification 11 View
2001-08-06 CLM Claims 6 View
2001-08-06 ABST Abstract 1 View
2001-08-06 DRW Drawings-only black and white line drawings 5 View
2001-08-06 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,407,448
App. No.
09/922,103
Filed
2001-08-06
Granted
2002-06-18
Pub. No.
US20010048151A1
Art Unit
2825
PTA
0 days