IP Library › Patent Application 10067765
Patent Application Utility
App. No. 10/067,765 · Confirmation No. 8449

PLANARIZATION OF A POLYSILICON LAYER SURFACE BY CHEMICAL MECHANICAL POLISH TO IMPROVE LITHOGRAPHY AND SILICIDE FORMATION

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2002-02-08 TRNA Transmittal of New Application 2 View
2002-02-08 ADS Application Data Sheet 3 View
2002-02-08 SPEC Specification 15 View
2002-02-08 CLM Claims 4 View
2002-02-08 ABST Abstract 1 View
2002-02-08 DRW Drawings-only black and white line drawings 4 View
2002-02-08 OATH Oath or Declaration filed 10 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
10/067,765
Filed
2002-02-08
Granted
2003-04-15
Pub. No.
US20020072219A1
Examiner
LUU, PHO M
Art Unit
2824
PTA
0 days