IP Library › Granted Patent US 6,660,633
Granted Patent Utility
US 6,660,633 · Confirmation No. 6544

METHOD OF REDUCING ELECTOMIGRATION IN A COPPER LINE BY ELECTROPLATING AN INTERIM COPPER-ZINC ALLOY THIN FILM ON A COPPER SURFACE AND A SEMICONDUCTOR DEVICE THEREBY FORMED

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2003-08-08 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-08-08 LET. Miscellaneous Incoming Letter 2 View
2003-07-23 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2003-06-25 LET. Miscellaneous Incoming Letter 3 View
2003-06-25 DRW Drawings-only black and white line drawings 2 View
2002-02-26 TRNA Transmittal of New Application 4 View
2002-02-26 ADS Application Data Sheet 2 View
2002-02-26 SPEC Specification 15 View
2002-02-26 CLM Claims 7 View
2002-02-26 ABST Abstract 1 View
2002-02-26 DRW Drawings-only black and white line drawings 5 View
2002-02-26 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,660,633
App. No.
10/083,809
Filed
2002-02-26
Granted
2003-12-09
Art Unit
2812
PTA
0 days