Patent Assignment
Reel/Frame 012649/0001
Assignment of Assignor's Interest
Recorded: 2002-02-26
Pages: 4
Assignee
ADVANCED MICRO DEVICES, INC.
P.O. BIX 3453, ONE AMD PLACE, M/S 68, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
Method of Reducing Electomigration in a Copper Line by Electroplating an Interim Copper-Zinc Alloy Thin Film on a Copper Surface and a Semiconductor Device Thereby Formed
Patent:
6,660,633 →
Application:
10/083,809 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Affirmation of Patent Assignment
Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023119/0083 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Security Interest
Jun 1, 2020
From: HARTLAND CONTROLS L.L.C.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 052803/0893 →
Assignment of Assignor's Interest
Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →