IP Library Granted Patent US 6,743,495
Granted Patent Utility
US 6,743,495 · Confirmation No. 8911

THERMAL ANNEALING PROCESS FOR PRODUCING SILICON WAFERS WITH IMPROVED SURFACE CHARACTERISTICS

⬇ PDF
Code Description Pages PDF
2014-01-30 OATH Oath or Declaration filed 65 View
2013-12-26 OATH Oath or Declaration filed 29 View
2013-12-26 OATH Oath or Declaration filed 42 View
2008-05-30 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-05-30 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-05-21 PA.. Power of Attorney 3 View
2008-05-21 N417 Electronic Filing System Acknowledgment Receipt 2 View
2005-02-22 ADS Application Data Sheet 5 View
2003-11-13 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-03-29 TRNA Transmittal of New Application 4 View
2002-03-29 ADS Application Data Sheet 3 View
2002-03-29 SPEC Specification 30 View
2002-03-29 CLM Claims 9 View
2002-03-29 ABST Abstract 1 View
2002-03-29 DRW Drawings-only black and white line drawings 6 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,743,495
App. No.
10/113,378
Filed
2002-03-29
Granted
2004-06-01
Pub. No.
US20020174828A1
Art Unit
1775
PTA
-31 days