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App. No. 10/180,740 · Confirmation No. 8818

METHOD AND APPARATUS FOR MONITORING A POLISHING CONDITION OF A SURFACE OF A WAFER IN A POLISHING PROCESS

Inventor: Karl E. Mautz
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2011-04-12 COCOUT Certificate of Correction - Post Issue Communication 1 View
2010-11-15 COCIN Request for Certificate of Correction 2 View
2010-11-15 N417 Electronic Filing System Acknowledgment Receipt 2 View
2004-01-14 IFEE Issue Fee Payment (PTO-85B) 2 View
2002-06-26 TRNA Transmittal of New Application 2 View
2002-06-26 SPEC Specification 11 View
2002-06-26 CLM Claims 5 View
2002-06-26 ABST Abstract 1 View
2002-06-26 DRW Drawings-only black and white line drawings 2 View
2002-06-26 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
10/180,740
Filed
2002-06-26
Granted
2004-03-23
Pub. No.
US20040002289A1
Art Unit
3723
PTA
-3 days