IP Library Granted Patent US 6,630,403
Granted Patent Utility
US 6,630,403 · Confirmation No. 5169

REDUCTION OF SURFACE ROUGHNESS DURING CHEMICAL MECHANICAL PLANARIZATION (CMP)

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Code Description Pages PDF
2003-07-28 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-07-28 LET. Miscellaneous Incoming Letter 2 View
2002-07-30 TRNA Transmittal of New Application 1 View
2002-07-30 SPEC Specification 12 View
2002-07-30 CLM Claims 8 View
2002-07-30 ABST Abstract 1 View
2002-07-30 DRW Drawings-only black and white line drawings 6 View
2002-07-30 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,630,403
App. No.
10/209,035
Filed
2002-07-30
Granted
2003-10-07
Pub. No.
US20020182868A1
Art Unit
1765
PTA
-14 days