CMP pad with composite transparent window
View Patent ↗The invention is directed to chemical-mechanical polishing pads comprising a transparent window. In one embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material comprises about 20 wt. % or more of the transparent window. In another embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of about 5 to 1000 nm, and wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 to 10,000 nm. In yet another embodiment, the transparent window comprises an inorganic/organic hybrid sol-gel material. In an additional embodiment, the transparent window comprises a polymer resin and a clarifying material, wherein the transparent window has a total light transmittance that is substantially higher than a window comprising only the polymeric resin.
1. A polishing pad for chemical-mechanical polishing comprising a transparent window, wherein the transparent window comprises at least one inorganic material and at least one organic material, and wherein the inorganic material comprises about 20 wt. % or more of the transparent window based on the total weight of the transparent window.
2. The polishing pad of claim 1 , wherein the transparent window has a total light transmittance of about 10% or more at at least one wavelength in the range of about 200 nm to about 10,000 nm.
3. The polishing pad of claim 2 , wherein the transparent window has a total light transmittance of about 10% or more at at least one wavelength in the range of about 200 nm to about 1,000 nm.
4. The polishing pad of claim 1 , wherein the inorganic material is an inorganic fiber or inorganic particle.
5. The polishing pad of claim 4 , wherein the inorganic material is selected from the group consisting of silica particles, alumina particles, ceria particles, diamond particles, glass fibers, carbon fibers, glass beads, mica particles, and combinations thereof.
6. The polishing pad of claim 1 , wherein the inorganic material has a dimension of about 1 micron or less.
7. The polishing pad of claim 6 , wherein the inorganic material has a dimension of about 0.1 nm to about 700 nm.
8. The polishing pad of claim 1 , wherein the organic material is a polymer resin selected from the group consisting of thermoplastic elastomers, thermoplastic polyurethanes, thermoplastic polyolefins, polycarbonates, polyvinylalcohols, nylons, elastomeric rubbers, elastomeric polyethylenes, polytetrafluoroethylene, polyethyleneteraphthalate, polyimides, polyaramides, polyarylenes, polystyrenes, polymethylmethacrylates, copolymers thereof, and mixtures thereof.
9. The polishing pad of claim 8 , wherein the polymer resin is a thermoplastic polyurethane.
10. The polishing pad of claim 1 , wherein the inorganic material comprises about 30 wt. % or more of the transparent window based on the total weight of the transparent window.
11. The polishing pad of claim 1 , wherein the inorganic material comprises about 95 wt. % or less of the transparent window based on the total weight of the transparent window.
12. The polishing pad of claim 1 , wherein the inorganic material is dispersed throughout the organic material.
13. The polishing pad of claim 1 , wherein the inorganic material is dispersed across a surface of the organic material.
14. A chemical-mechanical polishing apparatus comprising:
(a) a platen that rotates,
(b) a polishing pad comprising a transparent window, wherein the transparent window comprises at least one inorganic material and at least one organic material, and wherein the inorganic material comprises about 20 wt. % or more of the transparent window based on the total weight of the transparent window, and
(c) a carrier that holds a substrate to be polished by contacting the rotating polishing pad.
15. The chemical-mechanical polishing apparatus of claim 14 , further comprising an in situ polishing endpoint detection system.
16. A method of polishing a workpiece comprising
(i) providing a polishing pad comprising a transparent window, wherein the transparent window comprises at least one inorganic material and at least one organic material, and wherein the inorganic material comprises about 20 wt. % or more of the transparent window based on the total weight of the transparent window,
(ii) contacting a workpiece with the polishing pad, and
(iii) moving the polishing pad relative to the workpiece to abrade the workpiece and thereby polish the workpiece.
17. A polishing pad for chemical-mechanical polishing comprising a transparent window, wherein the transparent window comprises at least one inorganic material and at least one organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of about 5 nm to about 1000 nm, and wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 nm to about 10,000 nm.
18. The polishing pad of claim 17 , wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 nm to about 1,000 nm.
19. The polishing pad of claim 17 , wherein the inorganic material has a dimension of about 10 nm to about 700 nm.
20. The polishing pad of claim 17 , wherein the inorganic material comprises about 5 wt. % to about 75 wt. % of the transparent window based on the total weight of the transparent window.
21. The polishing pad of claim 17 , wherein the organic material is a polymer resin selected from the group consisting of thermoplastic elastomers, thermoplastic polyurethanes, thermoplastic polyolefins, polycarbonates, polyvinylalcohols, nylons, elastomeric rubbers, elastomeric polyethylenes, polytetrafluoroethylene, polyethyleneteraphthalate, polyimides, polyaramides, polyarylenes, polystyrenes, polymethylmethacrylates, copolymers thereof, and mixtures thereof.
22. The polishing pad of claim 21 , wherein the polymer resin is a thermoplastic polyurethane.
23. A chemical-mechanical polishing apparatus comprising:
(a) a platen that rotates,
(b) a polishing pad comprising a transparent window, wherein the transparent window comprises at least one inorganic material and at least one organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of about 5 nm to about 1000 nm, and wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 nm to about 10,000 nm, and
(c) a carrier that holds a substrate to be polished by contacting the rotating polishing pad.
24. The chemical-mechanical polishing apparatus of claim 23 , further comprising an in situ polishing endpoint detection system.
25. A method of polishing a workpiece comprising
(i) providing a polishing pad comprising a transparent window, wherein the transparent window comprises at least one inorganic material and at least one organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of about 5 nm to about 1000 nm, and wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 nm to about 10,000 nm,
(ii) contacting a workpiece with the polishing pad, and
(iii) moving the polishing pad relative to the workpiece to abrade the workpiece and thereby polish the workpiece.
26. A polishing pad for chemical-mechanical polishing comprising a transparent window, wherein the transparent window comprises an inorganic/organic hybrid sol-gel material.
27. The polishing pad of claim 26 , wherein the transparent window has a total light transmittance of about 10% or more at at least one wavelength in the range of about 200 nm to about 10,000 nm.
28. The polishing pad of claim 27 , wherein hybrid sol-gel material is a metal oxide-polymer hybrid material or a clay-polyamide hybrid material.
29. A chemical-mechanical polishing apparatus comprising:
(a) a platen that rotates,
(b) a polishing pad comprising a transparent window, wherein the transparent window comprises an inorganic/organic hybrid sol-gel material, and
(c) a carrier that holds a substrate to be polished by contacting the rotating polishing pad.
30. The chemical-mechanical polishing apparatus of claim 29 , further comprising an in situ polishing endpoint detection system.
31. A method of polishing a workpiece comprising
(i) providing a polishing pad comprising a transparent window, wherein the transparent window comprises an inorganic/organic hybrid sol-gel material,
(ii) contacting a workpiece with the polishing pad, and
(iii) moving the polishing pad relative to the workpiece to abrade the workpiece and thereby polish the workpiece.
32. A polishing pad for chemical-mechanical polishing comprising a transparent window, wherein the transparent window comprises at least one polymeric resin and at least one clarifying material, wherein the transparent window has a total light transmittance that is substantially higher than a window comprising only the polymeric resin.
33. The polishing pad of claim 32 , wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 nm to about 10,000 nm.
34. The polishing pad of claim 33 , wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 nm to about 1,000 nm.
35. The polishing pad of claim 32 , wherein the clarifying material is selected from the group consisting of phyllosilicate clays, micas, metal oxides, inorganic salts, polysaccharides, polymer fibers, and combinations thereof.
36. The polishing pad of claim 35 , wherein the clarifying material is a phyllosilicate clay having an aspect ratio of about 100 to about 200 and is selected from the group consisting of talc, kaolinite, montmorillonite, hectorite, and combinations thereof.
37. The polishing pad of claim 35 , wherein the metal oxide is titania.
38. The polishing pad of claim 35 , wherein the inorganic salt is calcium carbonate or sodium benzoate.
39. The polishing pad of claim 32 , wherein the polymer resin is selected from the group consisting of thermoplastic elastomers, thermoplastic polyurethanes, thermoplastic polyolefins, polycarbonates, polyvinylalcohols, nylons, elastomeric rubbers, elastomeric polyethylenes, polytetrafluoroethylene, polyethyleneteraphthalate, polyimides, polyaramides, polyarylenes, polystyrenes, polymethylmethacrylates, copolymers thereof, and mixtures thereof.
40. The polishing pad of claim 39 , wherein the polymer resin is nylon, and the clarifying material is talc, montmorillonite, fluorinated mica, or a combination thereof.
41. The polishing pad of claim 39 , wherein the polymer resin is polypropylene, and the clarifying material is talc, titania, sodium benzoate, a polysaccharide, calcium carbonate, or a combination thereof.
42. The polishing pad of claim 39 , wherein the polymer resin is polyethylene, and the clarifying material is talc.
43. The polishing pad of claim 32 , wherein the amount of the clarifying material is about 0.0001 wt. % or more, based on the total weight of the transparent window.