IP Library Granted Patent US 6,936,883
Granted Patent B2
US 6,936,883 · App. 10/409,333 · Granted Aug 30, 2005

Bi-directional read/program non-volatile floating gate memory cell and array thereof, and method of formation

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Quick Facts
Patent No.
US 6,936,883
App. No.
10/409,333
Granted
Aug 30, 2005
Kind
B2
Abstract

A bi-directional read/program non-volatile memory cell and array is capable of achieving high density. Each memory cell has two spaced floating gates for storage of charges thereon. The cell has spaced apart source/drain regions with a channel therebetween, with the channel having three portions. One of the floating gate is over a first portion; another floating gate is over a second portion, and a gate electrode controls the conduction of the channel in the third portion between the first and second portions. A control gate is connected to each of the source/drain regions, and is also capacitively coupled to the floating gate. The cell programs by hot channel electron injection, and erases by Fowler-Nordheim tunneling of electrons from the floating gate to the gate electrode. Bi-directional read permits the cell to be programmed to store bits, with one bit in each floating gate.

Claims (50)

1. A non-volatile memory cell for the storage of a plurality of bits, comprising:

a substantially single crystalline semiconductive material of a first conductivity type;

a first region of a second conductivity type, different from said first conductivity type in said material;

a second region of said second conductivity type in said material, spaced apart from said first region;

a channel region, having a first portion, a second portion and a third portion, connecting said first and second regions for the conduction of charges;

a dielectric on said channel region;

a first floating gate on said dielectric, spaced apart from said first portion of said channel region; said first portion of said channel region adjacent to said first region, said first floating gate for the storage of at least one of said plurality of bits;

a second floating gate on said dielectric, spaced apart from said second portion of said channel region; said second portion of said channel region adjacent to said second region, said second floating gate for the storage of at least another of said plurality of bits;

a gate electrode on said dielectric, spaced apart from said third portion of said channel region, said third portion of said channel region between said first portion and said second portion;

a first gate electrode electrically connected to said first region and capacitively coupled to said first floating gate; and

a second gate electrode electrically connected to said second region and capacitively coupled to said second floating gate.

2. The cell of claim 1 wherein said substantially single crystalline semiconductive material is single crystalline silicon having a planar surface.

3. The cell of claim 2 wherein said first portion of said channel region is substantially perpendicular to said planar surface.

4. The cell of claim 3 wherein said second portion of said channel region is substantially perpendicular to said planar surface.

5. The cell of claim 4 wherein said third portion of said channel region is substantially parallel to said planar surface.

6. The cell of claim 5 wherein said silicon has a first trench with a sidewall and a bottom wall, with said first portion of said channel region along said sidewall.

7. The cell of claim 6 wherein said silicon has a second trench with a sidewall and a bottom wall, with said second portion of said channel region along said sidewall.

8. The cell of claim 7 wherein said first floating gate is in said first trench spaced apart from said sidewall of said first trench; said first floating gate having a tip portion substantially perpendicular to said gate electrode.

9. The cell of claim 8 wherein said second floating gate is in said second trench spaced apart from said sidewall of said second trench; said second floating gate having a tip portion substantially perpendicular to said gate electrode.

10. The cell of claim 9 wherein said first region is along said bottom wall of said first trench.

11. The cell of claim 10 wherein said second region is along said bottom wall of said second trench.

12. The cell of claim 11 wherein said first gate electrode is in said first trench, spaced apart from said first floating gate and electrically connected to said first region.

13. The cell of claim 12 wherein said second gate electrode is in said second trench, spaced apart from said second floating gate and electrically connected to said second region.

14. An array of non-volatile memory cells, arranged in a plurality of rows and columns, said array comprising:

a substantially single crystalline semiconductive substrate material of a first conductivity type;

a plurality of non-volatile memory cells arranged in a plurality of rows and columns in said semiconductive substrate material with each cell for storing a plurality of bits, and with each cell comprising:

a first region of a second conductivity type, different from said first conductivity type in said material;

a second region of said second conductivity type in said material, spaced apart from said first region;

a channel region, having a first portion, a second portion and a third portion, connecting said first and second regions for the conduction of charges;

a dielectric on said channel region;

a first floating gate on said dielectric, spaced apart from said first portion of said channel region; said first portion of said channel region adjacent to said first region, said first floating gate for the storage of at least one of said plurality of bits;

a second floating gate on said dielectric, spaced apart from said second portion of said channel region; said second portion of said channel region adjacent to said second region, said second floating gate for the storage of at least another of said plurality of bits;

a gate electrode on said dielectric, spaced apart from said third portion of said channel region, said third portion of said channel region between said first portion and said second portion;

a first gate electrode electrically connected to said first region and capacitively coupled to said first floating gate; and

a second gate electrode electrically connected to said second region and capacitively coupled to said second floating gate;

wherein said cells in the same row have said gate electrode in common;

wherein said cells in the same column have said first region in common, said second region in common, said first gate electrode in common, and said second gate electrode in common; and

wherein said cell in adjacent columns have said first region in common and said first gate electrode in common.

15. The array of claim 14 wherein said substantially single crystalline semiconductive material is single crystalline silicon having a planar surface.

16. The array of claim 15 wherein said first portion of said channel region is substantially perpendicular to said planar surface.

17. The array of claim 16 wherein said second portion of said channel region is substantially perpendicular to said planar surface.

18. The array of claim 17 wherein said third portion of said channel region is substantially parallel to said planar surface.

19. The array of claim 18 wherein said silicon has a first trench with a sidewall and a bottom wall, with said first portion of said channel region along said sidewall.

20. The array of claim 19 wherein said silicon has a second trench with a sidewall and a bottom wall, with said second portion of said channel region along said sidewall.

21. The array of claim 20 wherein said first floating gate is in said first trench spaced apart from said sidewall of said first trench; said first floating gate having a tip portion substantially perpendicular to said gate electrode.

22. The array of claim 21 wherein said second floating gate is in said second trench spaced apart from said sidewall of said second trench; said second floating gate having a tip portion substantially perpendicular to said gate electrode.

23. The array of claim 22 wherein said first region is along said bottom wall of said first trench.

24. The array of claim 23 wherein said second region is along said bottom wall of said second trench.

25. The array of claim 24 wherein said first gate electrode is in said first trench, spaced apart from said first floating gate and electrically connected to said first region.

26. The array of claim 25 wherein said second gate electrode is in said second trench, spaced apart from said second floating gate and electrically connected to said second region.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →