Multi-layer polishing pad material for CMP
View Patent ↗The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.
1. A multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, wherein the polishing layer and the bottom layer are joined together without the use of an adhesive, and wherein (i) the polishing layer is porous and the bottom layer is non-porous or (ii) the polishing layer is non-porous and the bottom layer is porous.
2. The polishing pad of claim 1 wherein the polishing layer comprises a first polymer resin and the bottom layer comprises a second polymer resin.
3. The polishing pad of claim 2 , wherein the polishing layer comprises a thermoplastic polyurethane and the bottom layer comprises a polymer resin selected from the group consisting of polycarbonates, nylons, polyolefins, polyvinylalcohols, polyacrylates, polytetrafluoroethylene, polyethyleneterephthalate, polyimides, polyaramides, polyarylenes, polyacrylates, polystyrenes, polymethylmethacrylates, copolymers thereof, and mixtures thereof.
4. The polishing pad of claim 1 , wherein the polishing layer is substantially transparent.
5. The polishing pad of claim 4 , wherein the polishing layer comprises an aperture.
6. The polishing pad of claim 1 , wherein the bottom layer is substantially transparent.
7. The polishing pad of claim 6 , wherein the polishing layer comprises an aperture.
8. The polishing pad of claim 1 , wherein the polishing layer and the bottom layer comprise a polymer resin.
9. The polishing pad of claim 8 , wherein the polymer resin is selected from the group consisting of thermoplastic elastomers, thermoset polymers, polyurethanes, polyolefins, polycarbonates, polyvinylalcohols, nylons, elastomeric rubbers, elastomeric polyethylenes, polytetrafluoroethylene, polyethyleneterephthalate, polyimides, polyaramides, polyarylenes, polyacrylates, polystyrenes, polymethylmethacrylates, copolymers thereof, and mixtures thereof.
10. The polishing pad of claim 9 , wherein the polymer resin is a thermoplastic polyurethane.
11. The polishing pad of claim 1 , further comprising one or more middle layers disposed between the polishing layer and the bottom layer, wherein the middle layer or layers are substantially coextensive with the polishing layer and the bottom layer, and wherein the polishing layer, middle layer or layers, and the bottom layer are joined together without the use of any adhesive.
12. The polishing pad of claim 11 , wherein at least one of the polishing layer and the bottom layer is optically transmissive.
13. The polishing pad of claim 11 , wherein the middle layer is optically transmissive and the polishing layer and bottom layer are substantially opaque.
14. The polishing pad of claim 13 , wherein the polishing layer comprises a first aperture and the bottom layer comprises a second aperture, and wherein the first aperture is aligned with the second aperture.
15. The polishing pad of claim 11 , wherein the polishing layer, middle layer or layers, and the bottom layer comprise a polymer resin.
16. The polishing pad of claim 15 , wherein the polymer resin is selected from the group consisting of thermoplastic elastomers, thermoset polymers, polyurethanes, polyolefins, polycarbonates, polyvinylalcohols, nylons, elastomeric rubbers, elastomeric polyethylenes, polytetrafluoroethylene, polyethyleneterephthalate, polyimides, polyaramides, polyarylenes, polyacrylates, polystyrenes, polymethylmethacrylates, copolymers thereof, and mixtures thereof.
17. The polishing pad of claim 16 , wherein the polymer resin is a thermoplastic polyurethane.
18. A chemical-mechanical polishing apparatus comprising:
(a) a platen that rotates,
(b) the polishing pad of claim 11 affixed to the rotating platen, and
(c) a carrier that holds a workpiece to be polished by contacting the rotating polishing pad.
19. The chemical-mechanical polishing apparatus of claim 18 , further comprising an in situ endpoint detection system.
20. A method of polishing a workpiece comprising
(i) providing the polishing pad of claim 11 ,
(ii) contacting a workpiece with the polishing pad, and
(iii) moving the polishing pad relative to the workpiece to abrade the workpiece and thereby polish the workpiece.
21. The polishing pad of claim 1 , wherein the polishing pad does not comprise a middle layer disposed between the polishing layer and the bottom layer.
22. A chemical-mechanical polishing apparatus comprising:
(a) a platen that rotates,
(b) the polishing pad of claim 1 affixed to the rotating platen, and
(c) a carrier that holds a workpiece to be polished by contacting the rotating polishing pad.
23. The chemical-mechanical polishing apparatus of claim 22 , further comprising an in situ endpoint detection system.
24. A method of polishing a workpiece comprising
(i) providing the polishing pad of claim 1 ,
(ii) contacting a workpiece with the polishing pad, and
(iii) moving the polishing pad relative to the workpiece to abrade the workpiece and thereby polish the workpiece.
25. A multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer, a bottom layer, and one or more middle layers disposed between the polishing layer and the bottom layer, wherein (i) the polishing layer, the bottom layer, and the middle layer or layers are substantially coextensive, (ii) the polishing layer, middle layer or layers, and the bottom layer are joined together without the use of any adhesive, and (iii) the polishing layer and the bottom layer are porous and the middle layer or layers are non-porous.
26. A polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein (i) the optically transmissive polishing pad material comprises a first transmissive layer and a second transmissive layer that are joined together without the use of an adhesive and (ii) the first transmissive layer is porous and the second transmissive layer is non-porous.
27. The polishing pad of claim 26 , wherein the optically transmissive multi-layer polishing pad material is formed by coextrusion.
28. The polishing pad of claim 26 , wherein the first transmissive layer and the second transmissive layer comprise a polymer resin.
29. The polishing pad of claim 28 , wherein the polymer resin is selected from the group consisting of thermoplastic elastomers, thermoset polymers, polyurethanes, polyolefins, polycarbonates, polyvinylalcohols, nylons, elastomeric rubbers, elastomeric polyethylenes, polytetrafluoroethylene, polyethyleneterephthalate, polyimides, polyaramides, polyarylenes, polyacrylates, polystyrenes, polymethylmethacrylates, copolymers thereof, and mixtures thereof.
30. The polishing pad of claim 29 , wherein the polymer resin is a thermoplastic polyurethane.
31. The polishing pad of claim 26 , wherein the first transmissive layer comprises a first polymer resin, the second transmissive layer comprises a second polymer resin, and the first and second polymer resins are different.
32. The polishing pad of claim 31 , wherein the first transmissive layer comprises a thermoplastic polyurethane and the second transmissive layer comprises a polymer resin selected from the group consisting of polycarbonates, nylons, polyolefins, polyvinylalcohols, polyacrylates, polytetrafluoroethylene, polyethyleneterephthalate, polyimides, polyaramides, polyarylenes, polyacrylates, polystyrenes, polymethylmethacrylates, copolymers thereof, and mixtures thereof.
33. The polishing pad of claim 26 , wherein the optically transmissive multi-layer polishing pad material further comprises a third transmissive layer disposed between the first transmissive layer and the second transmissive layer.
34. The polishing pad of claim 26 , wherein the optically transmissive multi-layer polishing pad material does not comprise a layer disposed between the first transmissive layer and the second transmissive layer.
35. The polishing pad of claim 26 , wherein the optically transmissive multi-layer polishing pad material has a light transmittance of about 10% or more at at least one wavelength in the range of about 200 nm to about 10,000 nm.
36. A chemical-mechanical polishing apparatus comprising:
(a) a platen that rotates,
(b) the polishing pad of claim 26 , and
(c) a carrier that holds a workpiece to be polished by contacting the rotating polishing pad.
37. The chemical-mechanical polishing apparatus of claim 36 , further comprising an in situ endpoint detection system.
38. A method of polishing a workpiece comprising
(i) providing the polishing pad of claim 26
(ii) contacting a workpiece with the polishing pad, and
(iii) moving the polishing pad relative to the workpiece to abrade the workpiece and thereby polish the workpiece.