IP Library Granted Patent US 6,997,777
Granted Patent B2
US 6,997,777 · App. 10/463,721 · Granted Feb 14, 2006

Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region

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Quick Facts
Patent No.
US 6,997,777
App. No.
10/463,721
Granted
Feb 14, 2006
Kind
B2
Abstract

A method of forming a chemical-mechanical polishing pad having at least one optically transmissive region comprising (i) providing a polishing pad comprising an aperture, (ii) inserting an optically transmissive window into the aperture of the polishing pad, and (iii) bonding the optically transmissive window to the polishing pad by ultrasonic welding.

Claims (21)

1. A method of forming a chemical-mechanical polishing pad having at least one optically transmissive region comprising:

(i) providing a polishing pad with a body comprising an aperture,

(ii) inserting an optically transmissive window into the aperture of the body of the polishing pad, and

(iii) bonding the optically transmissive window to the body of the polishing pad by ultrasonic welding to form a polishing pad having the optically transmissive window; wherein (a) the body of the polishing pad comprises a thermosetting polymer resin and the optically transmissive window comprises a thermoplastic polymer resin or (b) the body of the polishing pad comprises a thermoplastic polymer resin and the optically transmissive window comprises a thermosetting polymer resin.

2. The method of claim 1 , wherein the polymer resin is selected from the group consisting of thermoplastic elastomers, thermoset polymers, polyurethanes, polyolefins, polycarbonates, polyvinylalcohols, nylons, elastomeric rubbers, elastomeric polyethylenes, polytetrafluoroethylene, polyethyleneterephthalate, polyimides, polyaramides, polyarylenes, copolymers thereof, and mixtures thereof.

3. The method of claim 2 , wherein the optically transmissive window comprises thermoplastic polyurethane.

4. The method of claim 1 , wherein the body of the polishing pad is a sintered polishing pad, a solid polishing pad, or a porous foam polishing pad.

5. The method of claim 1 , wherein the body of the polishing pad and the optically transmissive window each comprise a different polymer resin.

6. The method of claim 5 , wherein the body of the polishing pad comprises a thermosetting polymer resin and the optically transmissive window comprises a thermoplastic polymer resin.

7. The method of claim 6 , wherein the body of the polishing pad comprises a thermosetting polyurethane resin and the optically transmissive window comprises a thermoplastic polyurethane resin.

8. The method of claim 1 , wherein the body of the polishing pad is porous and the optically transmissive window is solid.

9. The method of claim 5 , wherein the body of the polishing pad comprises a thermoplastic polymer resin and the optically transmissive window comprises a thermosetting polymer resin.

10. The method of claim 1 , wherein the body of the polishing pad is a multilayer body comprising a top pad and a bottom pad.

11. The method of claim 10 , wherein the optically transmissive window is welded to the top pad of the multilayer body of the polishing pad.

12. The method of claim 1 , wherein the optically transmissive window has the shape of an oval or a circle.

13. The method of claim 1 , wherein the bonding step involves the use of a weld time of about 1 second or less.

14. The method of claim 1 , wherein the bonding step involves the use of an actuator pressure of about 0.2 MPa to about 0.45 MPa.

15. The method of claim 1 , wherein the optically transmissive window comprises a ledge portion and a non-ledge portion.

16. The method of claim 15 , wherein the optically transmissive window further comprises an energy director.

17. A chemical-mechanical polishing pad having at least one optically transmissive region produced by the method of claim 1 .

18. A chemical-mechanical polishing pad having at least one optically transmissive region produced by the method of claim 8 .

Assignments (7)
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →