IP Library Granted Patent US 7,050,316
Granted Patent B1
US 7,050,316 · App. 10/797,207 · Granted May 23, 2006

Differential non-volatile content addressable memory cell and array using phase changing resistor storage elements

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,050,316
App. No.
10/797,207
Granted
May 23, 2006
Kind
B1
Abstract

A differential sensing content addressable memory cell without any word lines connected to the cells in the same row comprises a first bit line for supplying a first bit. A first storage element has a first phase change resistor for storing a first stored bit, which is connected in series with a first diode. The first storage element is connected to the first bit line. A second bit line supplies a second bit, with the second bit being an inverse of the first bit. A second storage element has a second phase change resistor for storing a second stored bit, which is connected in series with a second diode. The second storage element is connected to the second bit line. A match line is connected to the first and second storage elements for indicating whether a match occurred between the first bit and the first stored bit, and between the second bit and the second stored bit

Claims (33)

1. A content addressable memory cell comprising:

a first bit line for supplying a first bit;

a first storage element of a first phase change resistor for storing a first stored bit, connected in series with a first diode; said first storage element connected to said first bit line;

a second bit line for supplying a second bit, said second bit being an inverse of said first bit;

a second storage element of a second phase change resistor for storing a second stored bit, connected in series with a second diode; said second storage element connected to said second bit line; and

a match line connected to said first and second storage elements for indicating whether a match occurred between said first bit and said first stored bit, and between said second bit and said second stored bit.

2. The cell of claim 1 wherein each of said first and second phase change resistor is made of chalcogenide material.

3. The cell of claim 2 wherein each cell is capable of storing one of three possible states:

a first state representing a data bit of “1” wherein the first stored bit represents a bit “1” and the second stored bit represents a bit “0”;

a second state representing a data bit of “0” wherein the first stored bit represents a bit “0” and the second stored bit represents a bit “1”;

a third state representing a “don't care” state wherein the first stored bit represents a bit “0” and the second stored bit represents a bit “0”.

4. The cell of claim 1 wherein said first diode connects said first phase change resistor to said match line; and

wherein said second diode connects said second phase change resistor to said match line.

5. The cell of claim 1 wherein said first diode connects said first phase change resistor to said first bit line; and

wherein said second diode connects said second phase change resistor to said second bit line.

6. An array of content addressable memory cells comprising:

a plurality of content addressable memory cells arranged in a plurality of rows and columns;

a plurality of pairs of bit lines arranged in columns; each pair of bit lines for supplying a first bit and a second bit with said second bit being an inverse of said first bit; a pair of bit lines being supplied to the cells arranged in the same column;

a plurality of match lines, wherein each match line is connected to the cells arranged in the same row; and

wherein each cell comprises:

a first storage element of a first phase change resistor for storing a first stored bit, connected in series with a first diode;

a second storage element of a second phase change resistor for storing a second stored bit, connected in series with a second diode;

wherein the first storage element is connected to an associated match line and to one of a pair of associated bit lines; and

wherein each of the second storage element is connected to said associated match line and to another of said pair of associated bit lines.

7. The cell of claim 6 wherein each of said first and second phase change resistors is made of chalcogenide material.

8. The cell of claim 7 wherein each cell is capable of storing one of three possible states:

a first state representing a data bit of “1” wherein the first stored bit represents a bit “1” and the second stored bit represents a bit “0”;

a second state representing a data bit of “0” wherein the first stored bit represents a bit “0” and the second stored bit represents a bit “1”;

a third state representing a “don't care” state wherein the first stored bit represents a bit “0” and the second stored bit represents a bit “0”.

9. The array of claim 6 wherein said first diode connects said first phase change resistor to an associated match line; and

wherein said second diode connects said second phase change resistor to said associated match line.

10. The array of claim 6 wherein said first diode connects said first phase change resistor to one of a pair of associated bit lines; and

wherein said second diode connects said second phase change resistor to another of said pair of associated bit lines.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →