IP Library Granted Patent US 6,972,985
Granted Patent B2
US 6,972,985 · App. 10/868,578 · Granted Dec 6, 2005

Memory element having islands

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Quick Facts
Patent No.
US 6,972,985
App. No.
10/868,578
Granted
Dec 6, 2005
Kind
B2
Abstract

A memory including a memory element having islands is provided. The memory has address decoding circuitry and an array of memory plugs. The memory plugs include memory element that have island structures of a first material within the bulk of a second material. The island structures are typically nanoparticles. The memory plugs can be placed in a first resistive state at a first write voltage, placed in a second resistive state at a second write voltage, and have its resistive state determined at a read voltage.

Claims (28)

1. A memory comprising:

address lines operable to carry addresses;

control lines operable to carry control signals;

data lines operable to carry data;

array lines;

an address decoder that decodes the address on the address lines and activates certain array lines;

drivers that, as a function of the control signals, can cause some array lines to be placed at a first write voltage, a second write voltage, or a read voltage;

two-terminal memory plugs, each two-terminal memory plug electrically connected to at least one array line, the two-terminal memory plug being able to be reversibly written to a first resistive state when the some array lines are at the first write voltage, reversibly written to a second resistive state when the some array lines are at the second write voltage, and have its resistive state undisturbed when the some array lines are at the read voltage;

wherein the two-terminal memory plugs include memory elements that have island structures of a first material within the bulk of a second material.

2. The memory of claim 1 , wherein the first material is more conductive than the second material.

3. The memory of claim 2 , wherein second material is a semiconductor.

4. The memory of claim 3 , wherein the second material is a perovskite.

5. The memory of claim 4 , wherein the first material is formed through deposition of a reactive metal in middle of the perovskite.

6. The memory of claim 2 , wherein the first material is a non-reactive metal.

7. The memory of claim 2 , wherein the first material is separated from the bulk of the second material by an insulating envelope.

8. The memory of claim 1 , wherein the two-terminal memory plug includes electrodes at each terminal.

9. The memory of claim 8 , wherein the electrodes are formed in parallel planes and the islands are formed in a plane that is parallel the planes of the electrodes.

10. The memory of claim 1 , wherein the islands are between 0.5 and 50 nanometers thick.

11. The memory of claim 1 , wherein a transistor is interposed between each of the two-terminal memory plugs and the at least one array line that it is electrically connected to.

12. The memory of claim 1 , wherein each of the two-terminal memory plug is in electrical contact with exactly two array lines such that each terminal is connected to one array line.

13. A memory comprising:

address lines;

address decoding circuitry in communication with the address lines; and

addressable two-terminal memory plugs that are activated by the address decoding circuitry, each two-terminal memory plug including

a pair of electrodes, each electrode defining a terminal; and

nanoparticles of a first material embedded within the bulk of a second material,

the bulk of the second material being in electrical communication with the electrodes;

wherein, when the addressable two-terminal memory plug is activated, the addressable two-terminal memory plug can be reversibly written to a first resistive state at a fist write voltage, reversibly written to a second resistive state at a second write voltage, and have its resistive state determined at a read voltage.

Assignments (6)
NUNC PRO TUNC ASSIGNMENT Recorded Jun 21, 2018
From: UNITY SEMICONDUCTOR CORPORATION
To: HEFEI RELIANCE MEMORY LIMITED
Reel/Frame 046407/0710 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2018
From: RAMBUS INC.
To: HEFEI RELIANCE MEMORY LIMITED
Reel/Frame 045984/0845 →
RELEASE Recorded Apr 9, 2012
From: SILICON VALLEY BANK; GOLD HILL CAPITAL
To: UNITY SEMICONDUCTOR, INC.
Reel/Frame 028132/0675 →
SECURITY AGREEMENT Recorded Apr 13, 2009
From: UNITY SEMICONDUCTOR CORPORATION
To: GOLD HILL CAPITAL
Reel/Frame 023129/0669 →
MERGER Recorded Jul 28, 2005
From: UNITY SEMICONDUCTOR CORPORATION
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 016323/0107 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2004
From: RINERSON, DARRELL; CHEVALLIER, CHRISTOPHE; SWAB, PHILIP; HSIA, STEVE; SANCHEZ, JOHN E. JR.; CALARRUDO, MARY; LONGCOR, STEVEN W.; KINNEY, WAYNE
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 015480/0666 →