IP Library Granted Patent US 7,075,848
Granted Patent B2
US 7,075,848 · App. 10/889,194 · Granted Jul 11, 2006

Redundancy circuit in semiconductor memory device having a multiblock structure

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Quick Facts
Patent No.
US 7,075,848
App. No.
10/889,194
Granted
Jul 11, 2006
Kind
B2
Abstract

A redundancy circuit in a semiconductor memory device having a multiblock structure in which a memory cell array is classified into a plurality of memory cell blocks, an integrated redundancy circuit having a plurality of fuse boxes for storing, per block, addresses of defective memory cells provided in the plurality of memory cell blocks, the plurality of fuse boxes being connected to the common precharge unit and being selectively activated in response to a block distinction selection signal.

Claims (37)

1. A redundancy circuit in a semiconductor memory device having a multiblock structure in which a memory cell array is classified into a plurality of memory cell blocks, the circuit comprising:

a common precharge unit; and

an integrated redundancy circuit having a plurality of fuse boxes for storing addresses of defective memory cells per memory cell block provided in the plurality of memory cell blocks, the plurality of fuse boxes being connected to the common precharge unit through block switches selectively activated in response to a block distinction selection signal.

2. The circuit as claimed in claim 1 , wherein the number of fuse boxes is equal to the number of memory cell blocks.

3. The circuit as claimed in claim 1 , wherein the fuse boxes comprise:

fuses that are integrated for multiple memory cell blocks.

4. The circuit as claimed in claim 1 wherein the integrated redundancy circuit is a single circuit providing redundancy to the plurality of memory cell blocks.

5. A semiconductor memory device having substitute memory cells for defective memory cells, the semiconductor memory device comprising:

a plurality of memory cell blocks including a plurality of non-defective memory cells and a plurality of the defective memory cells;

a plurality of the substitute memory cells;

an addressing mechanism for addressing the substitute memory cells instead of the defective memory cells in the semiconductor memory device; and

a single redundancy circuit for providing redundancy by operatively substituting the defective memory cells with the substitute memory cells using the addressing mechanism,

wherein the single redundancy circuit has a plurality of fuse boxes for storing addresses of the defective memory cells per memory cell block provided in the plurality of memory cell blocks, the plurality of fuse boxes being connected to a common precharge unit through block switches for selectively connecting the precharge node to a given one of the fuse boxes, selectively activated in response to a block distinction selection signal.

6. The semiconductor memory device of claim 5 wherein the single redundancy circuit using the fuse boxes is being used to address said substitute memory cells in place of the defective memory cells.

7. The semiconductor memory device of claim 5 wherein the single redundancy circuit further comprises:

a precharge node that is precharged by the common precharge unit at a predetermined voltage level in response to a redundancy signal.

8. The semiconductor memory device of claim 7 further comprising:

a pass transistor array for changing a voltage level of the precharge node in conformity with a fuse programming in response to a redundancy address;

a state sustainable circuit for maintaining the voltage level of the precharge node during a redundancy operating mode; and

a redundancy enable signal generating circuit for commonly receiving output logic levels of the state sustainable circuit through one input terminal thereof, and individually receiving block redundancy addresses through another input terminal thereof, to generate a redundancy enable signal per memory cell block.

9. The semiconductor memory device of claim 5 wherein the single redundancy circuit is used to provide redundancy for the defective memory cells in the plurality of memory cell blocks.

10. A semiconductor memory device, comprising:

a memory cell array comprised of a plurality of memory cell blocks;

a common precharge unit for precharging a precharge node by a predetermined voltage level in response to a redundancy signal;

a plurality of fuse boxes grouped by numbers corresponding to the memory cell blocks;

a block switch for selectively connecting the precharge node to at least one of the plurality of fuse boxes in response to a block redundancy addressing signal;

a pass transistor array for changing a voltage level of the precharge node in conformity with a fuse programming in response to a redundancy address;

a state sustainable circuit for maintaining the voltage level of the precharge node during a redundancy operating mode; and

a redundancy enable signal generating circuit for commonly receiving output logic levels of the state sustainable circuit through one input terminal thereof, and individually receiving block redundancy addresses through another input terminal thereof, to generate a redundancy enable signal per memory cell block.

11. A method of providing redundant memory cells to operatively substitute defective memory cells in a semiconductor memory device, the method comprising:

providing a common precharge unit;

providing an integrated redundancy circuit having a plurality of fuse boxes for storing addresses of the defective memory cells per memory cell block provided in a plurality of memory cell blocks, the plurality of fuse boxes being connected to the common precharge unit; and

selectively activating the fuse boxes through block switches in response to a block distinction selection signal.

12. The method of claim 11 further comprising:

addressing a redundant memory cell through the integrated redundancy circuit to operatively substitute the defective memory cells in the semiconductor memory device.

13. The method of claim 11 further comprising:

providing substitute memory cells that are addressed through the fuse boxes in response to the block distinction selection signal to operatively substitute the defective memory cells.

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY'S NAME PREVIOUSLY RECORDED ON REEL 058297 FRAME 0646. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Aug 29, 2023
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: MOSAID TECHNOLOGIES INCORPORATED
Reel/Frame 064746/0409 →
CHANGE OF NAME Recorded Oct 19, 2021
From: CONVERSANT INTELLECTUAL PROPERTY INC.
To: MOSAID TECHNOLOGIES INCORPORATED
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RELEASE OF SECURITY INTEREST Recorded Nov 10, 2020
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To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
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RELEASE OF U.S. PATENT AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Oct 12, 2018
From: ROYAL BANK OF CANADA, AS LENDER
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
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AMENDED AND RESTATED U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Aug 22, 2018
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To: CPPIB CREDIT INVESTMENTS, INC.
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U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Sep 9, 2014
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CPPIB CREDIT INVESTMENTS INC., AS LENDER; ROYAL BANK OF CANADA, AS LENDER
Reel/Frame 033706/0367 →
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From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
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To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.; CONVERSANT IP N.B. 868 INC.; CONVERSANT IP N.B. 276 INC.
Reel/Frame 033484/0344 →
CHANGE OF NAME Recorded Mar 13, 2014
From: MOSAID TECHNOLOGIES INCORPORATED
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 032439/0638 →
U.S. INTELLECTUAL PROPERTY SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) - SHORT FORM Recorded Jan 10, 2012
From: 658276 N.B. LTD.; 658868 N.B. INC.; MOSAID TECHNOLOGIES INCORPORATED
To: ROYAL BANK OF CANADA
Reel/Frame 027512/0196 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2010
From: SAMSUNG ELECTRONICS CO., LTD.
To: MOSAID TECHNOLOGIES INCORPORATED
Reel/Frame 025423/0274 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2004
From: CHOI, BYUNG-GIL; KIM, DU-EUNG; KWAK, CHOONG-KEUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015574/0337 →