Face-to-face bonded I/O circuit die and functional logic circuit die system
An integrated circuit system includes a first set of integrated circuit dice each member of the set having a different configuration of input/output circuits disposed thereon and a second set of integrated circuit dice each having different logical function circuits disposed thereon. Each member of the first and second sets of integrated circuit dice include an array of face-to-face bonding pads disposed thereon that mate with the array of face-to-face bonding pads of each member of the other set.
1. An integrated circuit system including:
a first integrated circuit die having a plurality of wire-bonding pads and an array of face-to-face bonding structures disposed on a face thereof, the first integrated circuit die also having only input/output circuits disposed thereon, first ones of the input/output circuits having inputs connected to ones of the wire-bonding pads and outputs connected to ones of the face-to-face bonding structures, and second ones of the input/output circuits having inputs connected to ones of the face-to-face bonding structures and outputs connected to ones of the wire-bonding pads; and
a second integrated circuit die having an array of face-to-face bonding structures disposed on a face thereof, the array of face-to-face bonding structures mating with the array of face-to-face bonding structures disposed on the first integrated circuit die, the second integrated circuit die having only logical function circuits disposed thereon, input elements associated with the logical function circuits coupled to first ones of the face-to-face bonding structures, and output elements associated with the logical function circuits coupled to second ones of the face-to-face bonding structures.
2. The integrated circuit system of claim 1 wherein input/output circuits are disposed in a peripheral portion of said first integrated circuit die and said mating face-to-face bonding pads are disposed on said opposing face of said first integrated circuit die at an interior portion thereof.
3. The integrated circuit system of claim 1 wherein said mating face-to-face bonding are disposed at least partially over said input/output circuits.
4. The integrated circuit system of claim 1 further including additional circuits disposed under said mating face-to-face bonding pads.
5. The integrated circuit system of claim 1 wherein said logical function circuits on said second integrated circuit die include a field programmable gate array.
6. The integrated circuit system of claim 5 further including additional circuits disposed under said mating face-to-face bonding pads.
7. The integrated circuit system of claim 6 wherein said additional circuits include a digital-to-analog converter circuit.
8. The integrated circuit system of claim 6 wherein said additional circuits include an analog-to-digital converter circuit.
9. The integrated circuit system of claim 6 wherein said additional circuits include a voltage-regulator circuit.
10. The integrated circuit system of claim 6 wherein said additional circuits include a field-programmable-gate-array programming-control circuit.
11. The integrated circuit system of claim 6 wherein said additional circuits include at least one charge-pump circuit.
12. The integrated circuit system of claim 6 wherein said additional circuits include a data-conditioning circuit.
13. The integrated circuit system of claim 12 wherein said data-conditioning circuit comprises a serdes circuit.
14. The integrated circuit system of claim 13 wherein said data-conditioning circuit comprises a bus-interface circuit.
15. The integrated circuit system of claim 1 wherein:
at least some of the input/output circuits are programmable, and
program-control registers coupled to the at least some of the input/output circuits are disposed on the first die.
16. An input/output integrated circuit die for use in an integrated-circuit system including:
a plurality of wire-bonding pads disposed on a face thereof;
an array of face-to-face bonding structures disposed on the face thereof said array being arranged in a match pattern;
a plurality of input/output circuits comprising the only circuits on the integrated circuit die, first ones of the input/output circuits having inputs connected to ones of the wire-bonding pads and outputs connected to ones of the face-to-face bonding structures, and second ones of the input/output circuits having inputs connected to ones of the face-to-face bonding structures and outputs connected to ones of the wire-bonding pads.
17. An integrated circuit system including:
a set of first integrated circuit dice, each member of the set of first integrated circuit dice having a plurality of wire-bonding pads and an array of face-to-face bonding structures disposed on a face thereof, each member of the set of first integrated circuit dice also having only input/output circuits disposed thereon, first ones of the input/output circuits having inputs connected to ones of the wire-bonding pads and outputs connected to ones of the face-to-face bonding structures, and second ones of the input/output circuits having inputs connected to ones of the face-to-face bonding structures and outputs connected to ones of the wire-bonding pads, each member of the set of first integrated circuit dice having a different configuration of I/O pad connections; and
a set of second integrated circuit dice, each member of the set of second integrated circuit dice having an array of face-to-face bonding structures disposed on a face thereof that mates with the array of face-to-face bonding structures disposed on each member of the set of first integrated circuit dice, each member of the set of second integrated circuit dice having only different logical function circuits disposed thereon, input elements associated with the logical function circuits of each member of the set of second integrated circuit dice coupled to first ones of the face-to-face bonding structures, and output elements associated with the logical function circuits of each member of the set of second integrated circuit dice coupled to second ones of the face-to-face bonding structures.
18. The integrated circuit system of claim 17 wherein the configuration of I/O pad connections in the first set comprises a different number of I/O connections.
19. The integrated circuit system of claim 17 wherein the logical function circuit of each logical function circuit in the second set is a programmable logic device and each logical function circuit in the second set includes a different number of gates.