High speed substrate aligner apparatus
View Patent ↗A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads. In other embodiments the substrate support employs a buffer system for buffering substrate inside the apparatus allowing for fast swapping of substrates.
1. A substrate aligner apparatus comprising:
a frame adapted to allow an edge gripping substrate transporter to transport a substrate to and from the aligner apparatus; and
an edge gripping chuck system connected to the frame, the edge gripping chuck system including
a rotatable edge gripping chuck including substrate supports for stably holding the substrate and at least one sensor located thereon, the at least one sensor being configured to detect a position determining feature of the substrate where the edge gripping chuck including the substrate supports and the at least one sensor are rotatable as a unit on a common axis of rotation, and
a rotationally fixed edge gripping transfer system, the edge gripping chuck system being configured for holding and rotationally positioning the substrate to a predetermined post alignment substrate orientation resulting in the edge gripping chuck system having a corresponding post alignment position relative to the transporter;
wherein the chuck system is configured to effect predetermined post alignment substrate orientation independent of the transporter so that regardless of the predetermined post alignment substrate orientation relative to the transporter and the resultant post alignment edge gripping chuck system position, post alignment transfer of the substrate to the transporter can be effected without rotational repositioning of the substrate.
2. The substrate aligner apparatus of claim 1 , wherein the edge gripping chuck system is configured to rotationally position the substrate while the edge gripping substrate transporter is located within the frame.
3. A substrate aligner apparatus comprising:
a frame adapted to allow a substrate transporter to transport a substrate to and from the aligner apparatus;
a rotatable sensor head with substrate supports for stably holding the substrate and at least one sensing device located thereon, the at least one sensing device for detecting a position determining feature of the substrate, the rotatable sensor head being movably connected to the frame by a driveshaft engaged to the rotatable sensor head for moving the rotatable sensor head including the substrate supports and the at least one sensing device relative to the frame as a unit on a common axis of rotation; and
a rotationally fixed substrate support mounted to the frame for supporting the substrate when the position determining feature is detected by the rotatable sensor head;
wherein the substrate support has support pads contacting a peripheral edge of the substrate and the sensing device is capable of detecting the position determining feature independent of the location of the position determining feature relative to the support pads.
4. The apparatus according to claim 3 , wherein the rotatable sensor head is configured to allow the substrate transporter to remain within the frame during alignment of the substrate.
5. The apparatus according to claim 3 , wherein the rotatable sensor head comprises substrate rest pads.
6. The apparatus according to claim 5 , wherein the substrate rest pads are located to contact an edge of the substrate.
7. The apparatus according to claim 3 , wherein the at least one sensing device comprises first and second sensing devices, the first sensing device located on an opposite side of the sensor head from the second sensing device.
8. The apparatus according to claim 7 , wherein the first and second sensing devices comprise reflective optical sensors.
9. The apparatus according to claim 7 , wherein the first and second sensing devices comprise through beam optical sensors, said through beam optical sensors each having a transmitter and a receiver.
10. The apparatus according to claim 3 , wherein the substrate support is movably mounted to the frame and is capable of movement relative to the rotatable sensor head along an axis of motion substantially coincident with an axis of rotation of the rotatable sensor head.
11. The apparatus according to claim 10 , wherein the support pads are substantially transparent.