Multi-layer polishing pad material for CMP

1. A multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer; wherein the bottom layer is substantially coextensive with the polishing layer; the polishing layer being directly interconnected with the bottom layer such that the interface between the polishing layer and the bottom layer is adhesive-free; the polishing layer having an average surface roughness, Ra, that is greater than the Ra of the bottom layer, and wherein the polishing layer has a pore cell density of or less than about 10 4 cells per cubic centimeter and the bottom layer has a pore cell density of less than about 10 4 cells per cubic centimeter, as determined by scanning electron microscopy.

2. The polishing pad of claim 1 , wherein the polishing layer and the bottom layer each comprise a plurality of pore cells having an average cell diameter in the in the range of about 15 to about 50 μm.

3. The polishing pad of claim 1 , wherein the Ra of the polishing layer is greater than about 25 μm.

4. The polishing pad of claim 1 , wherein the Ra of the bottom layer is less than about 20 μm.

5. The polishing pad of claim 1 , wherein the Ra of the polishing layer is greater than about 25 μm, and the Ra of the bottom layer is less than about 20 μm.

6. The polishing pad of claim 1 , wherein the polishing layer comprises a first polymer resin and the bottom layer comprises a second polymer resin.

7. The polishing pad of claim 6 , wherein the polishing layer comprises a thermoplastic polyurethane and the bottom layer comprises a polymer resin selected from the group consisting of a polycarbonate, a nylon, a polyolefin, a polyvinylalcohol, a polyacrylate, a polytetrafluoroethylene, a polyethyleneterephthalate, a polyimide, a polyaramide, a polyarylene, a polystyrene, a polymethylmethacrylate, a copolymer of any of the foregoing polymer resins, and a mixture thereof.

8. The polishing pad of claim 1 , wherein the bottom layer and the polishing layer each comprise a polymer resin is selected from the group consisting of a thermoplastic elastomer, a thermoset polymer, a polyurethane, a polyolefin, a polycarbonate, a polyvinylalcohol, a nylon, an elastomeric rubber, elastomeric a polyethylene, a polytetrafluoroethylene, a polyethyleneterephthalate, a polyimide, a polyaramide, a polyarylene, a polyacrylate, a polystyrene, apolymetbylmethacrylate, a copolymer of any of the foregoing resins, and a mixture thereof.

9. The polishing pad of claim 8 , wherein the polymer resin is a thermoplastic polyurethane.

10. A multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer; wherein the layers are substantially coextensive such that the interface between the layers is adhesive free; the polishing layer and the bottom layer each comprising a plurality of pore cells having an average pore diameter in the range of about 15 to about 50 μm; the polishing layer having a pore cell density of greater than about 10 4 cells per cubic centimeter and the bottom layer having a pore cell density of less than about 10 4 cells per cubic centimeter, as determined by scanning electron microscopy.

11. The polishing pad of claim 10 , wherein the polishing layer and the bottom layer each comprise the same polymer resin.

12. The polishing pad of claim 11 , wherein polymer resin is a thermoplastic polyurethane.

13. The polishing pad of claim 10 , further comprising one or more middle layers disposed between the polishing layer and the bottom layer, wherein the middle layer or layers are substantially coextensive with the polishing layer and the bottom layer, and wherein the polishing layer, middle layer or layers, and the bottom layer are fused to one another.

14. A method of polishing a workpiece comprising

contacting a workpiece with the polishing surface of the polishing pad of claim 1 , and

moving the polishing pad relative to the workpiece to abrade the workpiece and thereby polish the workpiece.