IP Library Granted Patent US 7,247,907
Granted Patent B2
US 7,247,907 · App. 11/134,557 · Granted Jul 24, 2007

Bidirectional split gate NAND flash memory structure and array, method of programming, erasing and reading thereof, and method of manufacturing

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Quick Facts
Patent No.
US 7,247,907
App. No.
11/134,557
Granted
Jul 24, 2007
Kind
B2
Abstract

A split gate NAND flash memory structure is formed on a semiconductor substrate of a first conductivity type. The NAND structure comprises a first region of a second conductivity type and a second region of the second conductivity type in the substrate, spaced apart from the first region, thereby defining a channel region therebetween. A plurality of floating gates are spaced apart from one another and each is insulated from the channel region. A plurality of control gates are spaced apart from one another, with each control gate insulated from the channel region. Each of the control gate is between a pair of floating gates and is capacitively coupled to the pair of floating gates. A plurality of select gates are spaced apart from one another, with each select gate insulated from the channel region. Each select gate is between a pair of floating gates.

Claims (37)

1. A NAND flash memory structure formed on a semiconductor substrate of a first conductivity type, said structure comprising:

a first region of a second conductivity type in said substrate;

a second region of the second conductivity type in said substrate, spaced apart from said first region, thereby defining a channel region therebetween;

a plurality of floating gates, spaced apart from one another, each insulated from the channel region;

a plurality of control gates, spaced apart from one another, each insulated from the channel region, each control gate being between a pair of floating gates and being capacitively coupled to said pair of floating gates; and

a plurality of select gates, spaced apart from one another, each insulated from the channel region, each select gate being between a pair of floating gates.

2. The NAND structure of claim 1 wherein each floating gate is between a control gate and a select gate.

3. The NAND structure of claim 1 wherein each floating gate is in a trench in said substrate and is spaced apart from a sidewall of the trench.

4. The NAND structure of claim 3 wherein each control gate is in a trench capacitively coupled to a pair of floating gates in the trench and is substantially T shaped.

5. The NAND structure of claim 1 wherein a first select gate is insulated from said channel region and is immediately adjacent to said first region; and wherein a second select gate is insulated from said channel region and is immediately adjacent to said second region.

6. The NAND structure of claim 5 wherein each of said first select gate and said second select gate is substantially rectilinearly shaped.

7. The NAND structure of claim 5 wherein each of said first select gate and said second select gate is substantially “L” shaped.

8. The NAND structure of claim 1 further comprising:

a plurality of third regions of the second conductivity type in said substrate, each capacitively coupled to said control gate.

9. The NAND structure of claim 1 wherein said channel region between said first region and said second region is a continuous channel region therebetween and each control gate is substantially T shaped.

10. An array of NAND flash memory structures, said array comprising:

a semiconductor substrate of a first conductivity type;

a plurality of NAND structure, each structure comprising:

a first region of a second conductivity type in said substrate;

a second region of the second conductivity type in said substrate, spaced apart from said first region, in a first direction, thereby defining a channel region therebetween;

a plurality of floating gates, spaced apart from one another, each insulated from the channel region;

a plurality of control gates, spaced apart from one another, each insulated from the channel region, each control gate being between a pair of floating gates and being capacitively coupled to said pair of floating gates;

a plurality of select gates, spaced apart from one another, each insulated from the channel region, each select gate being between a pair of floating gates; and

wherein NAND structures adjacent to one another in a second direction, substantially perpendicular to the first direction have the select gate connected to one another in the second direction, and the control gate connected to one another in the second direction.

11. The array of claim 10 further comprising:

a plurality of active regions in continuous strips parallel to one another in the first direction with an isolation region separating each pair of adjacent active regions;

wherein each of the select gate connecting one NAND structure to an adjacent NAND structure in the second direction crosses an isolation region; and

wherein each of the control gate connecting one NAND structure to an adjacent NAND structure in the second direction crosses an isolation region.

12. The array of claim 11 wherein the first region of a first NAND structure is electrically connected to the first region of a second NAND structure adjacent to one side of the first NAND structure in the first direction; and

wherein the second region of the first NAND structure is electrically connected to the second region of a third NAND structure adjacent to another side of the first NAND structure in the first direction.

13. The array of claim 10 wherein each floating gate is between a control gate and a select gate.

14. The array of claim 10 wherein each floating gate is in a trench in said substrate and is spaced apart from a sidewall of the trench.

15. The array of claim 14 wherein each control gate is in a trench capacitively coupled to a pair of floating gates in the trench and is substantially T shaped.

16. The array of claim 10 further comprising:

a plurality of third regions of the second conductivity type in said substrate, each capacitively coupled to said control gate.

17. The array of claim 10 wherein said channel region between said first region and said second region is a continuous channel region therebetween and each control gate is substantially T shaped.

18. The array of claim 10 wherein NAND structures connected electrically to one another in series and co-linear to one another terminate at a first end and at a second end, with said first end addressed by a first address, and the second end addressed by a second address, different from the first address.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2005
From: GAO, FENG; LIN, YA-FEN; COOKSEY, JOHN W.; CHEN, CHANGYUAN; WIDJAJA, YUNIARTO; LEE, DANA
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 016596/0340 →