INTEGRATED CIRCUIT PACKAGE SYSTEM
An integrated circuit package system is provided forming a first I/O cell having a first circuitry area and a first bond pad with the first circuitry area partitioned along a cell length and on opposing perimeter segment of the first bond pad, forming an I/O ring having the first I/O cell, forming an integrated circuit die having the I/O ring, and connecting an external interconnect and the first bond pad.
1 . An integrated circuit package system comprising:
forming a first I/O cell having a first circuitry area and a first bond pad with the first circuitry area partitioned along a cell length and on opposing perimeter segments of the first bond pad;
forming an I/O ring having the first I/O cell;
forming an integrated circuit die having the I/O ring; and
connecting an external interconnect and the first bond pad.
2 . The system as claimed in claim 1 further comprising:
forming a second I/O cell having a second circuitry area and a second bond pad; and
wherein:
forming the I/O ring includes:
forming the I/O ring having the second I/O cell.
3 . The system as claimed in claim 1 further comprising:
forming a second I/O cell having a second circuitry area and a second bond pad; and
wherein:
forming the I/O ring includes:
forming the I/O ring having the second I/O cell adjacent to the first I/O cell.
4 . The system as claimed in claim 1 further comprising:
forming a second I/O cell having a second circuitry area and a second bond pad; and
wherein:
forming the first I/O cell having the first circuitry area and the first bond pad includes:
forming the first bond pad at a first predetermined position in the I/O ring;
forming the second I/O cell having the second circuitry area and the second bond pad further includes:
forming the second bond pad at a second predetermined position in the I/O ring; and
forming the I/O ring further includes:
forming the I/O ring having the second I/O cell adjacent to the first I/O cell with the first bond pad and the second bond pad not in contact.
5 . The system as claimed in claim 1 wherein:
forming the first I/O cell includes:
forming a first tapered area of the first circuitry area; and further comprising:
forming a second I/O cell having a second circuitry area and a second bond pad, the second circuitry area has a second tapered area.
6 . An integrated circuit package system comprising:
forming a first I/O cell having a first circuitry area and a first bond pad with the first circuitry area partitioned along a cell length and on opposing perimeter segment of the first bond pad;
forming an I/O ring having the first I/O cell;
forming an integrated circuit die having the I/O ring; and
connecting an external interconnect and the first bond pad.
7 . The system as claimed in claim 6 further comprising forming a second I/O cell having a second circuitry area and a second bond pad with the second circuitry area partitioned along the cell length and on opposing perimeter segment of the second bond pad.
8 . The system as claimed in claim 6 further comprising forming a second I/O cell having a second circuitry area and a second bond pad, wherein the second I/O cell is formed at the cell length.
9 . The system as claimed in claim 6 wherein forming the first I/O cell having the first circuitry area and the first bond pad includes forming the first bond pad in geometric shape comprised of a line segment, an arc, or a combination thereof.
10 . The system as claimed in claim 6 further comprising forming a second I/O cell having a second circuitry area and a second bond pad, wherein the second I/O cell is connected to the external interconnect.
11 . An integrated circuit package system comprising:
a first I/O cell having a first circuitry area and a first bond pad with the first circuitry area partitioned along a cell length and on opposing perimeter segments of the first bond pad;
an I/O ring having the first I/O cell;
an integrated circuit die having the I/O ring; and
an interconnect between an external interconnect and the first bond pad.
12 . The system as claimed in claim 11 further comprising:
a second I/O cell having a second circuitry area and a second bond pad; and
wherein:
the I/O ring includes:
the I/O ring having the second I/O cell.
13 . The system as claimed in claim 11 further comprising:
a second I/O cell having a second circuitry area and a second bond pad; and
wherein:
the I/O ring includes:
the I/O ring having the second I/O cell adjacent to the first I/O cell.
14 . The system as claimed in claim 11 further comprising:
a second I/O cell having a second circuitry area and a second bond pad; and
wherein:
the first I/O cell having the first circuitry area and the first bond pad includes:
the first bond pad at a first predetermined position in the I/O ring;
the second I/O cell having the second circuitry area and the second bond pad further includes:
the second bond pad at a second predetermined position in the I/O ring; and
the I/O ring further includes:
the I/O ring having the second I/O cell adjacent to the first I/O cell such that the first bond pad and the second bond pad not in contact.
15 . The system as claimed in claim 11 wherein:
the first I/O cell includes:
a first tapered area of the first circuitry area; and further comprising:
a second I/O cell having a second circuitry area and a second bond pad, the second circuitry area has a second tapered area.
16 . The system as claimed in claim 11 wherein:
the first I/O cell with a cell width has the first circuitry area and the first bond pad with the first circuitry area partitioned along the cell length and on opposing perimeter segment of the first bond pad;
the I/O ring having the first I/O cell has a contact;
the integrated circuit die having the I/O ring has a core; and
the interconnect between the external interconnect and the first bond pad is a wire.
17 . The system as claimed in claim 16 further comprising a second I/O cell having a second circuitry area and a second bond pad with the second circuitry area partitioned along the cell length and on opposing perimeter segment of the second bond pad.
18 . The system as claimed in claim 16 further comprising a second I/O cell having a second circuitry area and a second bond pad, wherein the second I/O cell is formed at the cell length.
19 . The system as claimed in claim 16 wherein the first I/O cell having the first circuitry area and the first bond pad includes the first bond pad in geometric shape comprised of a line segment, an arc, or a combination thereof.
20 . The system as claimed in claim 16 further comprising a second I/O cell having a second circuitry area and a second bond pad with the interconnect between the second I/O cell and the external interconnect.