Dual molded multi-chip package system
View Patent ↗A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto, mounting a semiconductor device over the first encapsulation and connected to the lead, and forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
1. A method of manufacturing a dual molded multi-chip package system comprising:
forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead;
connecting a trace between and in direct contact with the lead and the first integrated circuit die with the trace entirely planar and in direct contact with a bottom surface of the first encapsulation and exposed to the external environment;
attaching an external interconnect, exposed to the external environment, and in direct contact with an end of the trace;
mounting a semiconductor device over the first encapsulation and connected to the lead; and
forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
2. The method as claimed in claim 1 further comprising forming an extension of the lead.
3. The method as claimed in claim 1 further comprising connecting a bond site and the first integrated circuit die.
4. The method as claimed in claim 1 further comprising forming a solder mask over the embedded integrated circuit package system.
5. The method as claimed in claim 1 further comprising connecting a second integrated circuit die and the first integrated circuit die with the trace.
6. A method of manufacturing a dual molded multi-chip package system comprising:
forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto with a first active side of the first integrated circuit die exposed;
forming a solder mask over the first encapsulation;
connecting a trace between and in direct contact with the lead and the first integrated circuit die with the trace entirely planar and in direct contact with a bottom surface of the first encapsulation and exposed to the external environment;
connecting an external interconnect, the external interconnect exposed to the external environment, and having the external interconnect formed in direct contact with an end of the trace;
mounting a semiconductor device over the first encapsulation and connected to the lead; and
forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
7. The method as claimed in claim 6 wherein forming the solder mask includes forming the solder mask over the first active side.
8. The method as claimed in claim 6 wherein forming the first encapsulation includes forming the first encapsulation coplanar with a first surface of the lead.
9. The method as claimed in claim 6 wherein forming the second encapsulation includes covering the lead and the first encapsulation coplanar with a first surface of the lead.
10. The method as claimed in claim 6 wherein mounting the semiconductor device includes mounting a third integrated circuit die.
11. A dual molded multi-chip package system comprising:
an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead;
a semiconductor device over the first encapsulation;
an internal interconnect between the lead and the semiconductor device;
a trace between and in direct contact with the lead and the first integrated circuit die with the trace entirely planar and in direct contact with a bottom surface of the first encapsulation and exposed to the external environment;
an external interconnect, exposed to the external environment, and in direct contact with an end of the trace; and
a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
12. The system as claimed in claim 11 further comprising an extension of the lead.
13. The system as claimed in claim 11 wherein the trace is between a bond site and the first integrated circuit die.
14. The system as claimed in claim 11 wherein the trace is on the first encapsulation.
15. The system as claimed in claim 11 further comprising a second integrated circuit die connected to the first integrated circuit die with the trace.
16. The system as claimed in claim 11 wherein:
the embedded integrated circuit package system has the first encapsulation partially covering the first integrated circuit die and the lead connected thereto with a first active side of the first integrated circuit die exposed;
the semiconductor device is attached to the first encapsulation with a first adhesive and connected to the lead;
the second encapsulation is over the semiconductor device and the embedded integrated circuit package system without covering the first active side; and
further comprising:
a solder mask over the first encapsulation.
17. The system as claimed in claim 16 wherein the solder mask includes the solder mask over the first active side.
18. The system as claimed in claim 16 wherein the first encapsulation includes the first encapsulation coplanar with a first surface of the lead.
19. The system as claimed in claim 16 wherein the second encapsulation includes a cover for the lead and the first encapsulation coplanar with a first surface of the lead.
20. The system as claimed in claim 16 wherein the semiconductor device includes a third integrated circuit die.