IP Library Granted Patent US 7,447,073
Granted Patent B2
US 7,447,073 · App. 11/707,341 · Granted Nov 4, 2008

Method for handling a defective top gate of a source-side injection flash memory array

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Quick Facts
Patent No.
US 7,447,073
App. No.
11/707,341
Granted
Nov 4, 2008
Kind
B2
Abstract

A memory system includes memory cells arranged in sectors. A decoder corresponding to a sector disables memory cells having a defective top gate. The decoder may include a low voltage or high voltage latch for the disabling. A top gate handling algorithm is included. The memory system may include dynamic top gate coupling. A programming algorithm and waveforms with top gate handling is included.

Claims (28)

1. A method comprising:

determining whether a memory cell has a good top gate and a good wordline;

selecting a redundant memory cell in the event that the memory cell does not have a good top gate and a good wordline;

verifying the memory cell or selected redundant memory cell; and

programming the memory cell or the selected redundant memory cell in the event that the memory cell or the selected redundant memory cell is not verified.

2. The method of claim 1 wherein said programming includes one terminal of said memory cell or bias thereof is fixed or incremental.

3. The method of claim 2 wherein said programming includes other terminals of said memory cell or biases being fixed or incremental.

4. The method of claim 1 wherein said memory cells are source side injection memory cells.

5. The method of claim 1 wherein said memory cells are tip erased memory cells.

6. The method of claim 1 further comprising performing a programming operation that uses a threshold to verify whether said memory cell or said selected redundant memory cell is acceptable for use.

7. The method of claim 6 wherein said programming operation includes cell parameters subject to an increment or count function to determine if the threshold is reached.

8. The method of claim 1 wherein a top gate is operated using capacitance loading and coupling handling.

9. The method of claim 1 wherein gate metal is arranged to minimize a coupling effect between top gate lines.

10. The method of claim 1 wherein top gates are coupled using dynamic coupling or pseudo-dynamic coupling.

11. A method comprising:

determining whether a memory cell has a good top gate;

selecting a redundant memory cell in the event that the memory cell does not have a good top gate;

verifying the memory cell or selected redundant memory cell; and

programming the memory cell or the selected redundant memory cell in the event that the memory cell or the selected redundant memory cell is not verified.

12. The method of claim 11 wherein said programming includes one terminal of said memory cell or bias thereof is fixed or incremental.

13. The method of claim 12 wherein said programming includes other terminals of said memory cell or biases being fixed or incremental.

14. The method of claim 11 wherein said memory cells are source side injection memory cells.

15. The method of claim 11 wherein said memory cells are tip erased memory cells.

16. The method of claim 11 further comprising performing a programming operation that uses a threshold to verify whether said memory cell or said selected redundant memory cell is acceptable for use.

17. The method of claim 16 wherein said programming operation includes cell parameters subject to an increment or count function to determine if the threshold is reached.

18. The method of claim 11 wherein a top gate is provided to enable operation using capacitance loading and coupling handling.

19. The method of claim 11 wherein gate metal is arranged to minimize a coupling effect between top gate lines.

20. The method of claim 11 wherein top gates are provided to enable coupling via dynamic coupling or pseudo-dynamic coupling.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →